NXP Semiconductors MKL02Z32CAF4R

Kinetis KL02: 48MHz Cortex-M0+ Ultra-Low Power MCU, 32KB Flash, 4KB SRAM, 20-WLCSP, Tape & Reel

Price and Stock

Authorized Distributors
Non-Authorized Stocking Distributors
Non-Authorized Dealers

Technical Specifications

Physical
MountSurface Mount
Number of Pins20
Weight4.592623 mg
Technical
Core ArchitectureARM
Data Bus Width32 b
Frequency48 MHz
InterfaceI2C, SPI, UART, USART
Max Frequency48 MHz
Max Operating Temperature85 °C
Max Supply Voltage3.6 V
Memory Size32 kB
Memory TypeFLASH
Min Operating Temperature-40 °C
Min Supply Voltage1.71 V
Number of I/Os18
Number of Timers/Counters2
Oscillator TypeInternal
PackagingCut Tape
PeripheralsBrown-out Detect/Reset, LVD, POR, PWM, WDT
RAM Size4 kB
Schedule B8542310000

Documents

Download datasheets and manufacturer documentation for NXP Semiconductors MKL02Z32CAF4R.

NXP Semiconductors SCT
Datasheet44 pages6 years ago
element14 APAC
Datasheet44 pages9 years ago
Newark
Datasheet44 pages9 years ago
Datasheet44 pages9 years ago
Datasheet44 pages9 years ago
Farnell
Datasheet44 pages9 years ago
Freescale Semiconductor
Datasheet41 pages10 years ago
Technical Drawing2 pages11 years ago
Augswan
Datasheet20 pages11 years ago
Future Electronics
Datasheet2 pages10 years ago

Inventory History

3 month trend:
-0.73%

Engineering Resources

View Evaluation kits and Reference designs for NXP Semiconductors MKL02Z32CAF4R.

Related Parts

Descriptions

Descriptions of NXP Semiconductors MKL02Z32CAF4R provided by its distributors.

Kinetis KL02: 48MHz Cortex-M0+ Ultra-Low Power MCU, 32KB Flash, 4KB SRAM, 20-WLCSP, Tape & Reel
RISC Microcontroller, 32-Bit, FLASH, CORTEX-M0 CPU, 48MHz, CMOS, PBGA20
MCU 32-bit Kinetis KL02 ARM Cortex M0+ RISC 32KB Flash 3.3V 20-Pin WLCSP T/R
IC, MCU, CORTEX M0+, 48MHZ, 20WLCSP; Controller Family/Series:Kinetis KL02; Core Size:32bit; No. of I/O's:18; Supply Voltage Min:1.71V; Supply Voltage Max:3.6V; Digital IC Case Style:WLCSP; No. of Pins:20; Program Memory Size:32KB;

Manufacturer Aliases

NXP Semiconductors has several brands around the world that distributors may use as alternate names. NXP Semiconductors may also be known as the following names:

  • NXP
  • PHILIPS
  • PHIL
  • PHI
  • PHILLIPS
  • NXP USA Inc
  • NXP SEMI
  • NXP SEMICONDUCTOR
  • PHILIPS/NXP
  • PHILIPS SEMICONDUCTORS
  • PHILIP
  • Philips Semiconductor
  • NXP/PHILIPS
  • PHILPS
  • PHILIPS COMPONENTS
  • PHILIPS SEMI
  • PHL
  • PHLIPS
  • NXP Semicon
  • PHILIPS ECG
  • NXP / Freescale
  • PHILL
  • Philips Semiconducto
  • PHILLIP
  • PHILI
  • Philips Semiconductors
  • NXP Semiconductors NV
  • NXP

Technical Specifications

Physical
MountSurface Mount
Number of Pins20
Weight4.592623 mg
Technical
Core ArchitectureARM
Data Bus Width32 b
Frequency48 MHz
InterfaceI2C, SPI, UART, USART
Max Frequency48 MHz
Max Operating Temperature85 °C
Max Supply Voltage3.6 V
Memory Size32 kB
Memory TypeFLASH
Min Operating Temperature-40 °C
Min Supply Voltage1.71 V
Number of I/Os18
Number of Timers/Counters2
Oscillator TypeInternal
PackagingCut Tape
PeripheralsBrown-out Detect/Reset, LVD, POR, PWM, WDT
RAM Size4 kB
Schedule B8542310000

Documents

Download datasheets and manufacturer documentation for NXP Semiconductors MKL02Z32CAF4R.

NXP Semiconductors SCT
Datasheet44 pages6 years ago
element14 APAC
Datasheet44 pages9 years ago
Newark
Datasheet44 pages9 years ago
Datasheet44 pages9 years ago
Datasheet44 pages9 years ago
Farnell
Datasheet44 pages9 years ago
Freescale Semiconductor
Datasheet41 pages10 years ago
Technical Drawing2 pages11 years ago
Augswan
Datasheet20 pages11 years ago
Future Electronics
Datasheet2 pages10 years ago

Compliance

Environmental Classification
REACH SVHCNo SVHC
RoHSCompliant
Compliance Statements
Materials Sheet5 pages8 years ago
Rohs Statement1 page11 years ago
Reach Statement3 pages11 years ago
Conflict Mineral Statement1 page10 years ago
Rohs Statement1 page12 years ago
Reach Statement2 pages8 years ago