NXP Semiconductors MCIMX6S8DVM10AB

i.MX 6 series 32-bit MPU, ARM Cortex-A9 core, 1GHz, MAPBGA 624

Technical Specifications

Physical
Case/PackageMAPBGA
Number of Pins624
Weight1.25251 g
Technical
Core ArchitectureARM
Data Bus Width32 b
Frequency1 GHz
InterfaceCAN, EBI/EMI, Ethernet, I2C, I2S, MMC, PCI, PCIe, SD, SPI, UART, USB
Max Frequency1 GHz
Max I/O Voltage3.6 V
Max Operating Temperature95 °C
Max Supply Voltage3.6 V
Memory Size96 kB
Memory TypeExternal Program Memory, L2 Cache, ROM, SRAM
Min Operating Temperature0 °C
Min Supply Voltage1.65 V
Number of Cores1
Number of I/Os224
Oscillator TypeInternal
PackagingCut Tape
PeripheralsDMA, PWM, WDT
RAM Size128 kB

Documents

Download datasheets and manufacturer documentation for NXP Semiconductors MCIMX6S8DVM10AB.

NXP Semiconductors
Datasheet169 pages6 years ago
Newark
Datasheet170 pages10 years ago
Datasheet168 pages10 years ago
Datasheet169 pages10 years ago
Upverter
Datasheet167 pages11 years ago
NXP Semiconductors SCT
Datasheet169 pages6 years ago
Freescale Semiconductor
Technical Drawing2 pages12 years ago
SHENGYU ELECTRONICS
Datasheet4 pages10 years ago
Future Electronics
Datasheet115 pages11 years ago

Inventory History

3 month trend:
+0.00%

Engineering Resources

View Evaluation kits and Reference designs for NXP Semiconductors MCIMX6S8DVM10AB.

Related Parts

Descriptions

Descriptions of NXP Semiconductors MCIMX6S8DVM10AB provided by its distributors.

i.MX 6 series 32-bit MPU, ARM Cortex-A9 core, 1GHz, MAPBGA 624
RISC Microprocessor, 1000MHz, CMOS, PBGA2240
MPU, 32BIT, 1GHZ, MAPBGA-624; Product Range: i.MX Family i.MX 6Solo Series Microprocessors; MPU Core Size: 32bit; Program Memory Size: -; No. of Pins: 624Pins; MPU Case Style: MAPBGA; Supply Voltage Min: 1.35V; Supply Voltage

Manufacturer Aliases

NXP Semiconductors has several brands around the world that distributors may use as alternate names. NXP Semiconductors may also be known as the following names:

  • NXP
  • PHILIPS
  • PHIL
  • PHI
  • PHILLIPS
  • NXP USA Inc
  • NXP SEMI
  • NXP SEMICONDUCTOR
  • PHILIPS/NXP
  • PHILIPS SEMICONDUCTORS
  • PHILIP
  • Philips Semiconductor
  • NXP/PHILIPS
  • PHILPS
  • PHILIPS COMPONENTS
  • PHILIPS SEMI
  • PHL
  • PHLIPS
  • NXP Semicon
  • PHILIPS ECG
  • NXP / Freescale
  • PHILL
  • Philips Semiconducto
  • PHILLIP
  • PHILI
  • Philips Semiconductors
  • NXP Semiconductors NV
  • NXP

Technical Specifications

Physical
Case/PackageMAPBGA
Number of Pins624
Weight1.25251 g
Technical
Core ArchitectureARM
Data Bus Width32 b
Frequency1 GHz
InterfaceCAN, EBI/EMI, Ethernet, I2C, I2S, MMC, PCI, PCIe, SD, SPI, UART, USB
Max Frequency1 GHz
Max I/O Voltage3.6 V
Max Operating Temperature95 °C
Max Supply Voltage3.6 V
Memory Size96 kB
Memory TypeExternal Program Memory, L2 Cache, ROM, SRAM
Min Operating Temperature0 °C
Min Supply Voltage1.65 V
Number of Cores1
Number of I/Os224
Oscillator TypeInternal
PackagingCut Tape
PeripheralsDMA, PWM, WDT
RAM Size128 kB

Documents

Download datasheets and manufacturer documentation for NXP Semiconductors MCIMX6S8DVM10AB.

NXP Semiconductors
Datasheet169 pages6 years ago
Newark
Datasheet170 pages10 years ago
Datasheet168 pages10 years ago
Datasheet169 pages10 years ago
Upverter
Datasheet167 pages11 years ago
NXP Semiconductors SCT
Datasheet169 pages6 years ago
Freescale Semiconductor
Technical Drawing2 pages12 years ago
SHENGYU ELECTRONICS
Datasheet4 pages10 years ago
Future Electronics
Datasheet115 pages11 years ago

Compliance

Environmental Classification
Halogen FreeHalogen Free
Lead FreeLead Free
Radiation HardeningNo
REACH SVHCNo SVHC
RoHSCompliant
Compliance Statements
Materials Sheet5 pages9 years ago
Rohs Statement1 page11 years ago
Reach Statement3 pages11 years ago
Conflict Mineral Statement1 page10 years ago
Rohs Statement1 page12 years ago
Reach Statement2 pages8 years ago