NXP Semiconductors MC9S08QE128CLH

MCU 8-bit S08 S08 CISC 128KB Flash 2.5V/3.3V Automotive 64-Pin LQFP Tray

Price and Stock

Technical Specifications

Physical
Case/PackageLQFP
Contact PlatingTin
MountSurface Mount
Number of Pins64
Technical
Core ArchitectureS08
Data Bus Width8 b
Density1 Mb
Frequency50.33 MHz
InterfaceI2C, LIN, SCI, SPI
Max Frequency50.33 MHz
Max Operating Temperature85 °C
Max Supply Voltage3.6 V
Memory Size128 kB
Memory TypeFLASH
Min Operating Temperature-40 °C
Min Supply Voltage1.8 V
Number of ADC Channels24
Number of Bits8
Number of I/Os54
Number of Programmable I/O54
Number of PWM Channels12
Number of Timers/Counters3
Oscillator TypeInternal
PeripheralsI2C, LVD, PWM, WDT
RAM Size8 kB
Schedule B8542310000
Watchdog TimerYes

Documents

Download datasheets and manufacturer documentation for NXP Semiconductors MC9S08QE128CLH.

Future Electronics
Datasheet52 pages9 years ago
element14 APAC
Datasheet50 pages18 years ago
Datasheet6 pages15 years ago
Datasheet50 pages18 years ago
Freescale Semiconductor
Datasheet52 pages9 years ago
Technical Drawing3 pages12 years ago
Augswan
Datasheet346 pages16 years ago

Inventory History

3 month trend:
+0.52%

Engineering Resources

View Evaluation kits and Reference designs for NXP Semiconductors MC9S08QE128CLH.

Related Parts

Descriptions

Descriptions of NXP Semiconductors MC9S08QE128CLH provided by its distributors.

MCU 8-bit S08 S08 CISC 128KB Flash 2.5V/3.3V Automotive 64-Pin LQFP Tray
8-Bit HCS08 Central Processor Unit | IC MCU 8BIT 128KB FLASH 64LQFP
MC9S08QE Series 8 kB RAM 128 KB Flash 8-Bit Flexis Microcontroller - LQFP-64
IC, SM, MCU, 8-BIT, S08, 128KB FLASH; Controller Family/Series:HCS08; Core Size:8bit; No. of I/O's:54; Program Memory Size:128 KB; RAM Memory Size:8KB; CPU Speed:50.33MHz; Oscillator Type:External, Internal; No. of Timers:3; Peripherals:ADC, Comparator, PWM, RTC, Timer; Embedded Interface Type:I2C, SCI, SPI; No. of PWM Channels:12; Digital IC Case Style:LQFP; Supply Voltage Range:1.8V to 3.6V; Operating Temperature Range:-40°C to +85°C; No. of Pins:64; MSL:MSL 3 - 168 hours; SVHC:No SVHC (18-Jun-2012); Base Number:HCS08; Clock Frequency:50.33MHz; Flash Memory Size:128KB; Interface:I2C, SCI, SPI; Interface:I2C, SCI, SPI; Interface Type:I2C, SCI, SPI; Memory Size:128Kb; Memory Type:Flash; Microprocessor/Controller Features:COP, DBG, RTC, Analog Comparator; No. of ADC Inputs:24; No. of Bits:8; No. of External Interrupts:16; No. of I/O's:54; Number of bits In Timer:16; Number of bits in ADC:12; Operating Temperature Max:85°C; Operating Temperature Min:-40°C; Package / Case:LQFP; Program Memory Size:128KB
Device Core = HCS08 / Data Bus Width Bit = 8 / Instruction Set Architecture = CISC / Family Name = S08QE / Clock Frequency Max. MHz = 50 / Program Memory Type = Flash / Program Memory Size KB = 128 / RAM Memory Size KB = 8 / Interfaces = I²C / Interfaces = SCI / Interfaces = SPI / ADC Channels = 22 / ADC Resolution Bit = 12 / Number of Programmable I/Os = 54 / Number of Timers/Counters = 4 / Comparators = 4 / Supply Voltage Min. V = 1.8 / Supply Voltage Max. V = 3.6 / Operating Temperature Min. °C = -40 / Operating Temperature Max. °C = 85 / Package Type = LQFP / Pins = 64 / Mounting Type = SMD / MSL = Level-3 / Packaging = Tray / Length mm = 10 / Width mm = 10 / Height mm = 1.4 / Reflow Temperature Max. °C = 260

Manufacturer Aliases

NXP Semiconductors has several brands around the world that distributors may use as alternate names. NXP Semiconductors may also be known as the following names:

  • NXP
  • PHILIPS
  • PHIL
  • PHI
  • PHILLIPS
  • NXP USA Inc
  • NXP SEMI
  • NXP SEMICONDUCTOR
  • PHILIPS/NXP
  • PHILIPS SEMICONDUCTORS
  • PHILIP
  • Philips Semiconductor
  • NXP/PHILIPS
  • PHILPS
  • PHILIPS COMPONENTS
  • PHILIPS SEMI
  • PHL
  • PHLIPS
  • NXP Semicon
  • PHILIPS ECG
  • NXP / Freescale
  • PHILL
  • Philips Semiconducto
  • PHILLIP
  • PHILI
  • Philips Semiconductors
  • NXP Semiconductors NV
  • NXP

Part Number Aliases

This part may be known by these alternate part numbers:

  • MC9S08QE128-CLH

Technical Specifications

Physical
Case/PackageLQFP
Contact PlatingTin
MountSurface Mount
Number of Pins64
Technical
Core ArchitectureS08
Data Bus Width8 b
Density1 Mb
Frequency50.33 MHz
InterfaceI2C, LIN, SCI, SPI
Max Frequency50.33 MHz
Max Operating Temperature85 °C
Max Supply Voltage3.6 V
Memory Size128 kB
Memory TypeFLASH
Min Operating Temperature-40 °C
Min Supply Voltage1.8 V
Number of ADC Channels24
Number of Bits8
Number of I/Os54
Number of Programmable I/O54
Number of PWM Channels12
Number of Timers/Counters3
Oscillator TypeInternal
PeripheralsI2C, LVD, PWM, WDT
RAM Size8 kB
Schedule B8542310000
Watchdog TimerYes

Documents

Download datasheets and manufacturer documentation for NXP Semiconductors MC9S08QE128CLH.

Future Electronics
Datasheet52 pages9 years ago
element14 APAC
Datasheet50 pages18 years ago
Datasheet6 pages15 years ago
Datasheet50 pages18 years ago
Freescale Semiconductor
Datasheet52 pages9 years ago
Technical Drawing3 pages12 years ago
Augswan
Datasheet346 pages16 years ago

Compliance

Environmental Classification
Radiation HardeningNo
REACH SVHCNo SVHC
RoHSCompliant
Compliance Statements
Materials Sheet5 pages9 years ago
Rohs Statement1 page11 years ago
Reach Statement3 pages11 years ago
Conflict Mineral Statement1 page10 years ago
Rohs Statement1 page12 years ago
Reach Statement2 pages8 years ago