NXP Semiconductors LPC812M101FD20FP
Technical Specifications
Physical
Case/PackageSOIC
MountSurface Mount
Number of Pins20
Technical
Core ArchitectureARM
Data Bus Width32 b
Frequency30 MHz
InterfaceI2C, SPI, USART
Max Frequency30 MHz
Max Operating Temperature85 °C
Max Supply Voltage3.6 V
Memory Size16 kB
Memory TypeFLASH
Min Operating Temperature-40 °C
Min Supply Voltage1.8 V
Number of I/Os14
Number of Programmable I/O14
Number of Timers/Counters3
Operating Supply Voltage3.3 V
PeripheralsI2C, PWM
RAM Size4 kB
Watchdog TimerYes
Inventory History
Inventory history trend unavailable
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
0 parts available
Documents
Download datasheets and manufacturer documentation for NXP Semiconductors LPC812M101FD20FP.
Engineering Resources
View Evaluation kits and Reference designs for NXP Semiconductors LPC812M101FD20FP.
Descriptions
Descriptions of NXP Semiconductors LPC812M101FD20FP provided by its distributors.
MCU 32-bit LPC800 ARM Cortex M0+ RISC 16KB Flash 3.3V 20-Pin SOIC
ARM Microcontrollers - MCU 32-bit ARM CortexM0+ Microcontroller
IC, MCU, 32BIT, CORTEX M0+, SO20; Controller Family/Series:LPC800; Core Size:32bit; No. of I/O's:18; Supply Voltage Min:1.8V; Supply Voltage Max:3.6V; Digital IC Case Style:SOIC; No. of Pins:20; Program Memory Size:16KB; RAM Memory Size:4KB; CPU Speed:30MHz; Peripherals:Comparator, PWM, Timer; Embedded Interface Type:I2C, SPI, USART; Operating Temperature Min:-40°C; Operating Temperature Max:85°C; MSL:(Not Available); SVHC:No SVHC (20-Jun-2013); Operating Temperature Range:-40°C to +85°C; Program Memory Size:16KB
Manufacturer Aliases
NXP Semiconductors has several brands around the world that distributors may use as alternate names. NXP Semiconductors may also be known as the following names:
- NXP
- PHILIPS
- PHIL
- PHI
- PHILLIPS
- NXP USA Inc
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- Philips Semiconductor
- NXP/PHILIPS
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- PHILIPS ECG
- NXP / Freescale
- PHILL
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
Inventory History
Inventory history trend unavailable
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
0 parts available
Technical Specifications
Physical
Case/PackageSOIC
MountSurface Mount
Number of Pins20
Technical
Core ArchitectureARM
Data Bus Width32 b
Frequency30 MHz
InterfaceI2C, SPI, USART
Max Frequency30 MHz
Max Operating Temperature85 °C
Max Supply Voltage3.6 V
Memory Size16 kB
Memory TypeFLASH
Min Operating Temperature-40 °C
Min Supply Voltage1.8 V
Number of I/Os14
Number of Programmable I/O14
Number of Timers/Counters3
Operating Supply Voltage3.3 V
PeripheralsI2C, PWM
RAM Size4 kB
Watchdog TimerYes
Documents
Download datasheets and manufacturer documentation for NXP Semiconductors LPC812M101FD20FP.
Compliance
Environmental Classification
Lead FreeLead Free
Radiation HardeningNo
REACH SVHCNo SVHC
RoHSCompliant
Compliance Statements