공급망
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.28
Introduction Date2014-08-25
Lifecycle StatusProduction (Last Updated: 4 months ago)
설명
유통업체에서 제공한 Winbond W979H2KBQX2I에 대한 설명입니다.
DRAM Chip Mobile LPDDR2 SDRAM 512Mbit 16Mx32 1.2V/1.8V 168-Pin WFBGA
BALL Parallel BOTTOM RAM SDRAM ic memory 85C 1.14V 536870912bit 12mm
LPDDR2 DRAM, 16MX32, CMOS, PBGA168
IC SDRAM 512MBIT 400MHZ 168WFBGA
DRAM 512Mb LPDDR2, x32, 400MHz, -40 ~ 85C
IC DRAM 512M PARALLEL 168WFBGA
제조업체 별칭
Winbond에는 유통업체가 대체하여 사용할 수 있는 전 세계 여러 브랜드가 있습니다. Winbond는 다음 이름으로도 알려져 있습니다:
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
기술 사양
Physical
Number of Pins168
Number of Terminals168
Technical
Frequency400 MHz
InterfaceParallel
Max Operating Temperature85 °C
Max Supply Voltage1.3 V
Memory TypeRAM, SDRAM
Min Operating Temperature-40 °C
Min Supply Voltage1.14 V
Number of Circuits1
Number of Ports1
Operating Supply Voltage1.2 V
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)800 µm
Length12 mm
Terminal Pitch500 µm
Width12 mm