공급망
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.36
Introduction Date2015-04-02
Lifecycle StatusProduction (Last Updated: 3 weeks ago)
관련 부품
MicronMT47H128M16RT-25E:C
2Gb (128M x 16) 128Mx16 1.7V 190mA 1.9V 400MHz Parallel 16bit FBGA-84 12.5mm*9mm*1.2mm
MicronMT41K128M16JT-107 IT:K
2Gb (128M x 16) 128Mx16 1.283V 156mA 1.45V 933MHz Parallel 16bit BGA 14mm*8mm*1.2mm
1.45 V 2 Gbit Parallel 800 MHz 13.75 ns SMT V89C SDRAM DDR3L Memory IC - FBGA-96
2G, 1.5V, DDR3, 128Mx16, 1333MT/s @ 9-9-9, 96 ball BGA (9mm x13mm) RoHS, IT
설명
유통업체에서 제공한 Winbond W972GG6KB-25에 대한 설명입니다.
256MB 128Mx16 1.7V 155mA 1.9V 400MHz Parallel 16bit BGA 12.5mm*8mm*800¦Ìm
DRAM Chip DDR SDRAM 2G-Bit 128M x 16 1.8V 84-Pin WBGA
EAR99 Surface Mount Tray 128MX16 ic memory 400MHz 400ps 12.5mm 2Gb
DDR2 DRAM, 128MX16, 0.4ns, CMOS, PBGA84
IC DDR2 SDRAM 2GBIT 2.5NS 84BGA
제조업체 별칭
Winbond에는 유통업체가 대체하여 사용할 수 있는 전 세계 여러 브랜드가 있습니다. Winbond는 다음 이름으로도 알려져 있습니다:
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
기술 사양
Physical
Case/PackageTFBGA
MountSurface Mount
Number of Pins84
Number of Terminals84
Technical
Access Time400 ps
Address Bus Width14 b
Data Bus Width16 b
Density2 Gb
Max Frequency400 MHz
Max Operating Temperature85 °C
Max Supply Current220 mA
Max Supply Voltage1.9 V
Min Operating Temperature0 °C
Min Supply Voltage1.7 V
Number of Circuits1
Number of Ports1
Operating Supply Voltage1.8 V
Schedule B8542320023
Dimensions
Height - Seated (Max)1.2 mm
Length12.5 mm
Terminal Pitch800 µm
Width8 mm