관련 부품
MicronMT47H128M8SH-25E IT:M
1Gb (128M x 8) 128Mx8 1.7V 120mA 1.9V 400MHz Parallel 8bit FBGA-60 10mm*8mm*1.2mm
MicronMT47H128M8SH-25E:M
1Gb (128M x 8) 128Mx8 1.7V 120mA 1.9V 400MHz Parallel 8bit FBGA-60 10mm*8mm*1.1mm
MicronMT47H256M4CF-3:H TR
Obsolete 2011 Volatile ROHS3Compliant ic memory 0C~85C TC 1.7V~1.9V 1Gb 256M x 4 450ps
ISSIIS42S16400J-7BLI
IC DRAM 64M PARALLEL 54TFBGA / 1 Meg Bits x 16 Bits x 4 Banks (64-MBIT) SYNCHRONOUS DYNAMIC RAM
ISSIIS42S16400J-6BLI
IC DRAM 64M PARALLEL 54TFBGA / 1 Meg Bits x 16 Bits x 4 Banks (64-MBIT) SYNCHRONOUS DYNAMIC RAM
설명
유통업체에서 제공한 Winbond W94AD6KBHX5I에 대한 설명입니다.
DRAM Chip Mobile LPDDR SDRAM 1Gbit 64Mx16 1.8V 60-Pin VFBGA
Surface Mount Tray 64MX16 SDRAM - Mobile LPDDR ic memory 200MHz 5ns 9mm 115mA
LPDDR1 DRAM, 64MX16, 5ns, CMOS, PBGA60
IC DRAM 1GBIT PARALLEL 60VFBGA
DRAM 1Gb LPDDR, x16, 200MHz, Ind temp
제조업체 별칭
Winbond에는 유통업체가 대체하여 사용할 수 있는 전 세계 여러 브랜드가 있습니다. Winbond는 다음 이름으로도 알려져 있습니다:
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
기술 사양
Physical
Case/PackageTFBGA
MountSurface Mount
Number of Pins60
Number of Terminals60
Technical
Access Time5 ns
Address Bus Width14 b
Data Bus Width16 b
Density1 Gb
Frequency200 MHz
InterfaceParallel
Max Frequency200 MHz
Max Operating Temperature85 °C
Max Supply Current115 mA
Max Supply Voltage1.95 V
Memory TypeLPDDR, RAM, SDRAM
Min Operating Temperature-40 °C
Min Supply Voltage1.7 V
Nominal Supply Current115 mA
Number of Circuits1
Number of Ports1
Operating Supply Voltage1.8 V
Schedule B8542320015
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)1.025 mm
Length9 mm
Terminal Pitch800 µm
Width8 mm