공급망
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.24
Introduction Date2010-10-15
Lifecycle StatusNRND (Last Updated: 4 months ago)
관련 부품
ISSIIS43R16160F-6BLI
256Mb £¨16M x 16£© 16Mx16 2.3V 170mA 2.7V 166MHz Parallel 16bit BGA 13mm*8mm*800¦Ìm
ISSIIS42S16160G-7BLI
16MEG X16, 256MBIT SYNCHRONOUS DRAM Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54
MicronMT47H64M8SH-25E:H
1.9 V 512 Mbit Parallel 400 MHz 400 ps SMT U88B SDRAM DDR2 Memory IC - FBGA-60
MicronMT47H64M8SH-25E IT:H
IC SDRAM 512MBIT 400MHZ 60FBGA / DRAM Chip DDR2 SDRAM 512Mbit 64Mx8 1.8V 60-Pin FBGA
MicronMT47H128M8SH-25E IT:M
1Gb (128M x 8) 128Mx8 1.7V 120mA 1.9V 400MHz Parallel 8bit FBGA-60 10mm*8mm*1.2mm
설명
유통업체에서 제공한 Winbond W9425G6JB-5에 대한 설명입니다.
4 M x 4 BANKS x 16 BITS DDR SDRAM | IC DRAM 256M PARALLEL 60TFBGA
DRAM Chip DDR SDRAM 256M-Bit 16Mx16 2.5V 60-Pin TFBGA
DDR1 DRAM, 16MX16, 0.7ns, CMOS, PBGA60
IC DRAM 256MBIT PARALLEL 60TFBGA
제조업체 별칭
Winbond에는 유통업체가 대체하여 사용할 수 있는 전 세계 여러 브랜드가 있습니다. Winbond는 다음 이름으로도 알려져 있습니다:
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
기술 사양
Physical
Case/PackageTFBGA
MountSurface Mount
Number of Pins60
Number of Terminals60
Technical
Access Time700 ps
Address Bus Width15 b
Density256 Mb
Frequency200 MHz
InterfaceParallel
Max Frequency200 MHz
Max Operating Temperature70 °C
Max Supply Current175 mA
Max Supply Voltage2.7 V
Memory TypeDDR SDRAM, RAM
Min Operating Temperature0 °C
Min Supply Voltage2.3 V
Nominal Supply Current120 mA
Number of Circuits1
Number of Ports1
Operating Supply Voltage2.5 V
Schedule B8542320015
Temperature GradeCommercial
Dimensions
Height - Seated (Max)1.2 mm
Length13 mm
Terminal Pitch800 µm
Width8 mm