공급망
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.71
Introduction Date2016-10-21
Lifecycle StatusNRND (Last Updated: 4 months ago)
설명
유통업체에서 제공한 Winbond W71NW11GF1EW에 대한 설명입니다.
Multichip Packages 1G-bit 1.8V NAND + 1G-bit LPDDR2 MCP x16/x16
Memory Circuit, 64MX16, CMOS, PBGA121
MCP 64Mx16 Flash + 64Mx16 DDR2 DRAM 1.8V
IC FLASH RAM 1GBIT 121WFBGA
WINBOND VFBGA
제조업체 별칭
Winbond에는 유통업체가 대체하여 사용할 수 있는 전 세계 여러 브랜드가 있습니다. Winbond는 다음 이름으로도 알려져 있습니다:
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
기술 사양
Physical
Number of Terminals121
Technical
Max Operating Temperature85 °C
Max Supply Voltage1.95 V
Min Operating Temperature-40 °C
Min Supply Voltage1.7 V
Number of Circuits1
Operating Supply Voltage1.8 V
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)800 µm
Length8 mm
Terminal Pitch500 µm
Width8 mm