공급망
Country of OriginTaiwan
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.36
Introduction Date2024-12-30
Lifecycle StatusProduction (Last Updated: 1 month ago)
설명
유통업체에서 제공한 Winbond W66DP2RQQAHJ에 대한 설명입니다.
LPDDR4 DRAM, 256MX32, CMOS, PBGA200
8GB LPDDR4/4X, DDP, X32, 2133MHZ
제조업체 별칭
Winbond에는 유통업체가 대체하여 사용할 수 있는 전 세계 여러 브랜드가 있습니다. Winbond는 다음 이름으로도 알려져 있습니다:
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
기술 사양
Physical
Case/PackageTFBGA
Number of Terminals200
Technical
Max Operating Temperature105 °C
Max Supply Current53 mA
Max Supply Voltage1.17 V
Min Operating Temperature-40 °C
Min Supply Voltage1.06 V
Nominal Supply Voltage (DC)1.1 V
Number of Circuits1
Number of Ports1
Dimensions
Height - Seated (Max)1.1 mm
Length14.5 mm
Terminal Pitch800 µm
Width10 mm