공급망
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.32
Introduction Date2019-05-30
Lifecycle StatusProduction (Last Updated: 4 months ago)
설명
유통업체에서 제공한 Winbond W63AH2NBVABI에 대한 설명입니다.
DRAM 1Gb LPDDR3, x32, 800MHz, Industrial Temp
LPDDR3 DRAM, 32MX32, CMOS, PBGA178
IC DRAM 1GBIT HSUL 12 178VFBGA
제조업체 별칭
Winbond에는 유통업체가 대체하여 사용할 수 있는 전 세계 여러 브랜드가 있습니다. Winbond는 다음 이름으로도 알려져 있습니다:
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
기술 사양
Physical
Number of Terminals178
Technical
Max Frequency800 MHz
Max Operating Temperature85 °C
Max Supply Current36 mA
Max Supply Voltage1.3 V
Min Operating Temperature-40 °C
Min Supply Voltage1.14 V
Number of Circuits1
Number of Ports1
Operating Supply Voltage1.2 V
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)1 mm
Length11.5 mm
Terminal Pitch800 µm
Width11 mm