공급망
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.32
Introduction Date2017-12-01
Lifecycle StatusObsolete (Last Updated: 1 year ago)
LTB Date2021-03-29
LTD Date2021-06-28
설명
유통업체에서 제공한 Winbond W631GU8MB09I에 대한 설명입니다.
IC MCU 32BIT 256KB FLASH 100LQFP
DDR3L DRAM, 128MX8, CMOS, PBGA78
IC SDRAM 1GB X8 1066MHZ 78WBGA
IC DRAM 1GBIT SSTL 15 78VFBGA
제조업체 별칭
Winbond에는 유통업체가 대체하여 사용할 수 있는 전 세계 여러 브랜드가 있습니다. Winbond는 다음 이름으로도 알려져 있습니다:
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
기술 사양
Physical
Number of Terminals78
Technical
Max Operating Temperature95 °C
Max Supply Voltage1.45 V
Min Operating Temperature-40 °C
Min Supply Voltage1.283 V
Number of Circuits1
Number of Ports1
Operating Supply Voltage1.35 V
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)1 mm
Length10.5 mm
Terminal Pitch800 µm
Width8 mm