공급망
Country of OriginTaiwan
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.51
Introduction Date2016-07-01
Lifecycle StatusProduction (Last Updated: 1 month ago)
관련 부품
MicrochipSST39VF1601C-70-4I-EKE
Microchip 16Mbit Split flash memory chip, Parallel interface, TSOP-48, 18.5 x 12.2 x 1.05mm
MicrochipSST39VF1681-70-4I-EKE
Parallel Flash, 2.7 - 3.6 V, 16 Mbit, x8, 70 ns, -40°C to +85°C, TSOP-48, RoHS
MicrochipSST39VF3202B-70-4I-EKE
SST39VF Series 32 Mbit 2 M x 16 3.6 V Multi-Purpose Flash Plus SMT- TSOP-48
InfineonS29AL016J70TFI020
Flash Memory, Parallel NOR, 16 Mbit, 2M x 8bit / 1M x 16bit, CFI, Parallel, TSOP, 48 Pins
InfineonS29AL016J70BFI010
IC FLASH 16MBIT PARALLEL 48FBGA FLASH - NOR Memory IC 16Mbit Parallel 70 ns 48-FBGA (8.15x6.15)
InfineonS29GL032N90TFI040
Parallel NOR Flash Memory, 32 Mbit Density, 90 ns Initial Access Time, TSOP-48, RoHS
설명
유통업체에서 제공한 Winbond W29N01HVDINA에 대한 설명입니다.
Surface Mount Tray 128MX8 FLASH - NAND (SLC) ic memory 25ns 6.5mm 1073741824bit 2.7V
SLC NAND Flash Serial 3V/3.3V 1G-bit 128M x 8 48-Pin VFBGA Tray
IC FLASH 1GBIT PARALLEL 48VFBGA / FLASH - NAND (SLC) Memory IC 1Gb (128M x 8) Parallel 25 ns 48-VFBGA (8x6.5)
1Gb (128M x 8) 2.7V 35mA 3.6V Parallel BGA SMD mount
IC FLASH 1GBIT PARALLEL 48VFBGA
제조업체 별칭
Winbond에는 유통업체가 대체하여 사용할 수 있는 전 세계 여러 브랜드가 있습니다. Winbond는 다음 이름으로도 알려져 있습니다:
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
기술 사양
Physical
Number of Pins48
Number of Terminals48
Technical
Max Operating Temperature85 °C
Max Supply Current35 mA
Max Supply Voltage3.6 V
Memory TypeFLASH
Min Operating Temperature-40 °C
Min Supply Voltage2.7 V
Nominal Supply Voltage (DC)3.3 V
Number of Circuits1
Schedule B8542320070
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)1 mm
Length8 mm
Terminal Pitch800 µm
Width6.5 mm