공급망
Country of OriginTaiwan
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.51
Introduction Date2016-07-01
Lifecycle StatusProduction (Last Updated: 1 month ago)
관련 부품
MicronMT29F1G08ABAEAH4:E TR
Active 2013 Non-Volatile ROHS3Compliant ic memory 0C~70C TA 2.7V~3.6V 1Gb 128M x 8
MicronMT29F2G08ABAEAH4-IT:E
IC FLASH 2GBIT PARALLEL 63VFBGA FLASH - NAND Memory IC 2Gbit Parallel 63-VFBGA (9x11)
InfineonS34ML01G200BHI000
S34ML01G1 Series 1 Gb (128 M x 8) 3 V SMT Embedded NAND Flash Memory - BGA-63
MicronMT29F2G08ABBEAH4-IT:E
SLC NAND Flash Parallel 1.8V 2G-bit 256M x 8 63-Pin VFBGA Tray / IC FLASH 2GBIT 63VFBGA
설명
유통업체에서 제공한 Winbond W29N01HVBINF에 대한 설명입니다.
Winbond 1Gbit SLC NANDflash memory chip, Parallel interface, VFBGA-63, 11.1 x 9.1 x 0.6mm
Surface Mount Tray 128MX8 FLASH - NAND (SLC) ic memory 25ns 9mm 1073741824bit 2.7V
SLC NAND Flash Parallel 3V/3.3V 1G-bit 128M x 8 63-Pin VFBGA
2.7V~3.6V 1Gbit VFBGA-63(9x11) NAND FLASH ROHS
IC FLASH 1GBIT PARALLEL 63VFBGA
VFBGA63 1GB L NAND FLASH 3V 4B
제조업체 별칭
Winbond에는 유통업체가 대체하여 사용할 수 있는 전 세계 여러 브랜드가 있습니다. Winbond는 다음 이름으로도 알려져 있습니다:
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
기술 사양
Physical
Number of Pins63
Number of Terminals63
Technical
Max Operating Temperature85 °C
Max Supply Current35 mA
Max Supply Voltage3.6 V
Memory TypeFLASH
Min Operating Temperature-40 °C
Min Supply Voltage2.7 V
Nominal Supply Voltage (DC)3.3 V
Number of Circuits1
Schedule B8542320070
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)1 mm
Length11 mm
Terminal Pitch800 µm
Width9 mm