공급망
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.51
Introduction Date2016-09-22
Lifecycle StatusProduction (Last Updated: 4 months ago)
관련 부품
MicrochipSST26VF032B-104I/TD
SST26VF032 Series 32 Mb (4M x 8) 3.6 V Serial Quad I/O Flash Memory- TBGA-24
MicrochipSST26VF064B-104I/TD
NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3.3V 64M-bit 24-Pin TBGA Tray
64Mb £¨8M x 8£© 8 M x 8 2.7V 35mA 3.6V 100MHz Parallel BGA 8mm*6mm*840¦Ìm
64Mb £¨8M x 8£© 8 M x 8 1.7V 60mA 1.95V 166MHz Parallel BGA 8mm*6mm*840¦Ìm
설명
유통업체에서 제공한 Winbond W25Q256JVBIQ에 대한 설명입니다.
NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V 256M-bit 32M x 8 6ns 24-Pin TFBGA Tray
Surface Mount Tray 32MX8 FLASH - NOR ic memory 133MHz 3ms 6mm 268435456bit
256Mb £¨32M x 8£© 2.7V 25mA 3.6V 133MHz SPI-Quad I/O BGA 8mm*6mm*850¦Ìm
256Mbit SPI TFBGA-24(6x8) NOR FLASH ROHS
IC FLSH 256MBIT SPI/QUAD 24TFBGA
256Mb Serial SpiFlash with Dual/Quad
제조업체 별칭
Winbond에는 유통업체가 대체하여 사용할 수 있는 전 세계 여러 브랜드가 있습니다. Winbond는 다음 이름으로도 알려져 있습니다:
- Winbond Electronics
- ISD
- WIN
- WINBON
- WINBOND ELECTRONICS CORP
- Winbond Electronics Corporation
- WINB
- WINDBOND
- WINDOND
- INFORMATION STORAGE DEVICES
- Winbond Elec
- WINBND
- WINBOD
- WinbondPb
- WINBOND/PBF
- WINBOND ELECTRO
- WINBOUND
- Winbond Electronics Corporation America
- WINBOND Semiconductor
- WINBONDELE
- WINBNDELEC
- WINBOND ELECT CORP
- WINBOn semiD
- WINBONB
- Winbond Corp
기술 사양
Physical
Case/PackageTFBGA
Number of Pins24
Number of Terminals24
Technical
Frequency104 MHz
InterfaceSerial
Max Frequency133 MHz
Max Operating Temperature85 °C
Max Supply Current25 mA
Max Supply Voltage3.6 V
Memory TypeFLASH
Min Operating Temperature-40 °C
Min Supply Voltage3 V
Number of Circuits1
Operating Supply Voltage3 V
Schedule B8542320070
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)1.2 mm
Length8 mm
Terminal Pitch1 mm
Width6 mm