TE Connectivity / Augat 816-AG11SM-LF

816-AG11SM-LF=SMT 800 DIP, RoHS, GOLD/TI

SOCKET IC, DIL, SMD, 0.3", 16WAY; Connector Type:DIP; Series:800; No. of Contacts:16; Pitch Spacing:2.54mm; Row Pitch:7.62mm; Contact Termination:Surface Mount Vertical; Contact Material:Beryllium Copper; Contact Plating:Gold; ;RoHS Compliant: Yes

SOCKET IC, DIL, SMD, 0.3", 16WAY; Connector Type:DIP; Pin Format:DIP; Ways, No. of:16; Contact Material:Beryllium Copper; Contact Plating:Gold; Lead Spacing:2.54mm; Series:800; Row Pitch:7.62mm; Mounting Type:PC Board; Approval Bodies:; Case Style:DIL; Current Rating:3A; Flammability Rating:UL94V-0; Insulator Material:Thermoplastic polyester; Length:20.32mm; Material:beryllium copper contacts; Max Contact Current:3A; Resistance, Contact:10mohm; Resistance, Insulation:5000Mohm; Temp, Op. Max:125°C; Temp, Op. Min:-55°C; Termination Type:SMD; Width, External:10.16mm; Capacitance:1pF; Contact Shell Plating:; Contact Style:Turned Pin; De-mating Force:63gf; Dielectric Strength, VAC:1kV; Mating Force:179gf; Max Height above Pcb:5.75mm; Pcb Clearance Min:3.07mm; Shell Contact Material:Brass