onsemi FPF2496UCX

DC-DC Converter, 5.5V In, 3.5V Out, 2.5A, WLCSP, SMD, Adhesive Mount, 1.22mm × 1.22mm × 380μm

Tape & Reel (TR) Current Limiting (Adjustable) Over Temperature Over Voltage Reverse Current UVLO e1 On/Off power distribution switch 1.21mm 5.5V 2.5A 100m Ohm

POWER LOAD DISTRIBUTION SWITCH, WLCSP-9; Power Load Switch Type: High Side; Input Voltage: 5.5V; Current Limit: 1A; On State Resistance: 75ohm; Distribution Switch Case Style: WLCSP; No. of Pins: 9Pins; Thermal Protection: Yes; On / Enable Input Polarity: Active High; No. of Outputs: 1Outputs; Operating Temperature Min: -40°C; Operating Temperature Max: 85°C; Product Range: -; Automotive Qualification Standard: -; RoHS Phthalates Compliant: Yes; MSL: MSL 1 - Unlimited; SVHC: No SVHC (27-Jun-2018)

The FPF2496 advanced load-management switch targets applications requiring a highly integrated solution. It disconnects loads powered from the DC power rail (<6 V) with stringent off-state current targets and high load capacitances (<100 µF). The FPF2496 consists of a slew-rate controlled low-impedance MOSFET switch (100 mΩ maximum) and integrated analog features. The slew-rate controlled turn-on characteristic prevents inrush current and the resulting excessive voltage droop on power rails. FPF2496 has over-voltage protection and over-temperature protection. The FPF2496 has a True Reverse-Current Blocking (TRCB) function that obstructs unwanted reverse current from VOUT to VIN during ON and OFF states. The exceptionally low off-state current drain (<2 µA maximum) facilitates compliance with standby power requirements. The input voltage range operates from 3.5 V to 5.5 VDC to support a wide range of applications in consumer, optical, medical, storage, portable, and industrial-device power management systems. Switch control is managed by a logic input (active LOW) capable of interfacing directly with low-voltage control signal / General-Purpose Input / Output (GPIO) without an external pull-down resistor. The device is packaged in advanced, fully “green” compliant, 1.21 mm x 1.21 mm, Wafer-Level Chip-Scale Package (WLCSP).