Laird A15324-01

Thermal Gap Filler Pad for High-Speed Computing and Telecommunications Bulk
$ 9.83
Production

가격 및 재고

데이터시트 및 문서

Laird A15324-01에 대한 데이터시트 및 제조업체 설명서를 다운로드하세요.

Laird

Datasheet2 페이지7년 전

element14 APAC

재고 내역

3개월간의 트렌드:
-28.07%

공급망

Introduction Date2024-12-13
Lifecycle StatusProduction (Last Updated: 5 years ago)
Manufacturer Lifecycle StatusACTIVE (Last Updated: 5 years ago)

설명

유통업체에서 제공한 Laird A15324-01에 대한 설명입니다.

Thermal Gap Filler Pad for High-Speed Computing and Telecommunications Bulk
Thermal Pad, Tflex 300 Series, 1.2 W/m.K, Silicone Elastomer, 1 mm, 229 mm
Thermal Gap Filler, 229 X 229Mm, 1Mm; Thermal Conductivity:1.2W/M.k; Conductive Material:Silicone Elastomer; Thickness:1Mm; Thermal Impedance:-; Dielectric Strength:-; External Length:229Mm; External Width:229Mm; Product Range:Tflex Rohs Compliant: Yes |Laird A15324-01
Film / Foil Colour = Light Green / Film / Foil Material = Silicone Elastomer / Hardness = 27 Shore 00 / Width mm = 228.6 / Flammability = UL 94 V0 / Reinforcement Carrier = Ceramic / Thermal Conductivity W/mK = 1.2 / Length mm = 228.6 / Operating Temperature Max. °C = 160 / Operating Temperature Min. °C = -40 / Shape = Square / Depth mm = 1

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