説明
Multicomp MCBB830の詳細は販売業者から提供されます。
BREADBOARD, SOLDERLESS, ABS; Board Type:; Type:Breadboard / Solderless; Material:ABS (Acrylonitrile
Soldering Material/Accessories
BREAD BOARD, ABS, SOLDERLESS, 56 X 165MM; Breadboard Type: Solderless Breadboard; Total Number of Tie Points: 830Tie Points; No. of Distribution Strips / Buses: 2Bus Strips; No. of Term; Available until stocks are exhausted
Breadboard, Solderless, Abs; Tipo De Placa:Placa De Pruebas/Sin Soldadura; Material De Placa:Abs (Acrilonitrilo Butadieno Estireno); Diámetro Del Orificio:-; Altura Externa:56Mm; Anchura Externa:165Mm; Grosor De Placa:8.5Mm |Multicomp MCBB830
メーカーの別名
Multicompは世界中でいくつかのブランドを持っており、販売業者が代替名として使用するかもしれません。 Multicomp は以下の名前でも知られているかもしれません：
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