Winbond W979H2KBQX2I

DRAM Chip Mobile LPDDR2 SDRAM 512Mbit 16Mx32 1.2V/1.8V 168-Pin WFBGA
Production
Pagina del produttoreScheda dati

Prezzo e stock

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DistributorSKUMinPkg
Component Stockers USAW979H2KBQX2I318
>1wk
Win SourceWS-W979H2KBQX2I88006
19h
ICPartonlineW979H2KBQX2I30.607
>1wk
Microchip USAW979H2KBQX2I386100Tray
2d
Hi-Tech Circuit Group Ltd.W979H2KBQX2I1500
1d

Schede tecniche e documenti

Scarica le schede tecniche e la documentazione del produttore per Winbond W979H2KBQX2I.

IHS

Datasheet122 pagine10 anni fa

Supply Chain

Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.32.00.28
Introduction Date2014-08-25
Lifecycle StatusProduction (Last Updated: 4 months ago)

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Descrizioni

Descrizioni di Winbond W979H2KBQX2I fornite dai suoi distributori.

DRAM Chip Mobile LPDDR2 SDRAM 512Mbit 16Mx32 1.2V/1.8V 168-Pin WFBGA
Verical
BALL Parallel BOTTOM RAM SDRAM ic memory 85C 1.14V 536870912bit 12mm
Fly-Wing Technology
LPDDR2 DRAM, 16MX32, CMOS, PBGA168
IHS
IC SDRAM 512MBIT 400MHZ 168WFBGA
YIC International
DRAM 512Mb LPDDR2, x32, 400MHz, -40 ~ 85C
Digi-ic_SMART PIONEER
IC DRAM 512M PARALLEL 168WFBGA
SHENGYU ELECTRONICS

Immagini

UTSource
Augswan

Alias del produttore

Winbond ha diversi marchi in tutto il mondo che i distributori possono utilizzare come nomi alternativi. Winbond può anche essere conosciuto con i seguenti nomi:

  • Winbond Electronics
  • ISD
  • WIN
  • WINBON
  • WINBOND ELECTRONICS CORP
  • Winbond Electronics Corporation
  • WINB
  • WINDBOND
  • WINDOND
  • INFORMATION STORAGE DEVICES
  • Winbond Elec
  • WINBND
  • WINBOD
  • WinbondPb
  • WINBOND/PBF
  • WINBOND ELECTRO
  • WINBOUND
  • Winbond Electronics Corporation America
  • WINBOND Semiconductor
  • WINBONDELE
  • WINBNDELEC
  • WINBOND ELECT CORP
  • WINBOn semiD
  • WINBONB
  • Winbond Corp