Texas Instruments DS25BR110TSD/NOPB
$ 3.271
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Cronologia dell'inventario
Tendenza a 3 mesi: +26.25%
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Supply Chain
Lifecycle StatusProduction (Last Updated: 6 days ago)
Manufacturer Lifecycle StatusACTIVE (Last Updated: 6 days ago)
Risorse di progettazione
Visualizza i kit di valutazione e i progetti di riferimento per Texas Instruments DS25BR110TSD/NOPB.
Kit di valutazione
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Descrizioni
Descrizioni di Texas Instruments DS25BR110TSD/NOPB fornite dai suoi distributori.
43mA LVDS 1 1 3V 0.35ns 3.6V LVDS -0.1V(Min) 100mV(Max) 3.125Gbps SON , 3mm*3mm*800¦Ìm
3.125-Gbps LVDS buffer with receive equalization 8-WSON -40 to 85
DS25BR110 Tape & Reel (TR) ACTIVE (Last Updated: 1day ago) e3 signal splitter 450mV 0.5mm -40C~85C 10muA
LVDS Buffer 3125Mbps 0.45V 8-Pin WSON EP T/R
Line Driver, 1 Func, 1 Driver, 1 Rcvr
BUFFER LVDS 3.125GBPS, POWERWISE; Device Type:Differential Buffer; Supply Current Max:43mA; Peak-to-Peak Jitter Max:150ps; Signaling Rate:3.125Gbps; Signal Input Type:CML, LVDS, LVPECL; Output Level Type:LVDS; Supply Voltage Range:3V to 3.6V; ESD HBM:7kV; Operating Temperature Range:-40°C to +85°C; Driver Case Style:LLP; No. of Pins:8; SVHC:No SVHC (20-Jun-2011); Amplifier Type:Buffer; Base Number:25; No. of Amplifiers:1; Output Type:Fully Differential; Package / Case:LLP; Supply Voltage Max:3.6V; Supply Voltage Min:3V; Termination Type:SMD
Alias del produttore
Texas Instruments ha diversi marchi in tutto il mondo che i distributori possono utilizzare come nomi alternativi. Texas Instruments può anche essere conosciuto con i seguenti nomi:
- TI
- TEXAS
- TEXAS INST
- TEXAS INSTR
- TEXAS INSTRUMENT
- TEXAS INSTRUMENTS INC
- TEXAS INS
- TEXAS INSTRU
- TEXAS INSTRUMEN
- TI/NS
- TEX
- Texas Instruments (TI)
- TEXASIN
- TEXAS INSTRUMENTS INCORPORATED
- TEXINS
- TEXAS INTRUMENTS
- TEAXS
- TEXASI
- TEXAS INSTRUM
- TI Texas Instruments
- TEXAS USD
- TEXAS INSRUMENTS
- TEXAS INSRUMENT
- TEXAS INSTUMENTS
- TI-ROHS
- Texas Instr.
- Texas Instruments Inc.
Cronologia dell'inventario
Tendenza a 3 mesi: +26.25%
Modelli CAD
Scarica il simbolo, l'impronta e il 3D STEP
Parti alternative
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Specifiche tecniche
Physical
Contact PlatingTin
MountSurface Mount
Number of Pins8
Technical
Data Rate3.125 Gbps
Max Input Current10 µA
Max Operating Temperature85 °C
Max Output Voltage450 mV
Max Power Dissipation2.08 W
Max Supply Current43 mA
Max Supply Voltage3.6 V
Min Operating Temperature-40 °C
Min Supply Voltage3 V
Nominal Supply Current43 mA
Number of Channels1
Number of Drivers1
Number of Elements1
Number of Receivers1
Operating Supply Current43 mA
Operating Supply Voltage3.3 V
PackagingCut Tape
Power Consumption115 W
Power Dissipation2.08 W
Propagation Delay465 ps
Schedule B8542390000
Turn-On Delay Time465 ps
Dimensions
Height800 µm
Length3 mm
Thickness800 µm
Width3 mm
Conformità
Classificazione ambientale
Lead FreeLead Free
Radiation HardeningNo
REACH SVHCNo
RoHSCompliant
Dichiarazioni di conformità