NXP Semiconductors MKL03Z8VFG4
$ 0.872
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Schede tecniche e documenti
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Supply Chain
Country of OriginMainland China
Export Control Classification Number (ECCN) Code3A991.A.2
Harmonized Tariff Schedule (HTS) Code8542.31.00.01
Introduction Date2014-07-07
Lifecycle StatusProduction (Last Updated: 2 weeks ago)
Parti correlate
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Kinetis KL02: 48MHz Cortex-M0+ Ultra-Low Power MCU, 8KB Flash, 1KB SRAM, 16-QFN
NXP SemiconductorsMKL02Z32VFG4
Kinetis KL02: 48MHz Cortex-M0+ Ultra-Low Power MCU, 32KB Flash, 4KB SRAM, 16-QFN
NXP SemiconductorsMKL03Z32VFG4
Kinetis KL03: 48MHz Cortex-M0+ Ultra-Low Power MCU, 32KB Flash, 2KB SRAM, 16-QFN
InfineonCY8C4013LQI-411T
MCU 32-Bit CY8Cxxx ARM Cortex M0 RISC 8KB Flash 1.8V/3.3V/5V 16-Pin QFN EP T/R
InfineonCY8C4013LQI-411
MCU 32-bit CY8Cxxx ARM Cortex M0 RISC 8KB Flash 2.5V/3.3V/5V 16-Pin QFN EP
InfineonCY8C4014LQI-421
MCU 32-bit ARM Cortex M0 RISC 16KB Flash 2.5V/3.3V/5V 16-Pin QFN EP Tray
Descrizioni
Descrizioni di NXP Semiconductors MKL03Z8VFG4 fornite dai suoi distributori.
Kinetis KL03: 48MHz Cortex-M0+ Ultra-Low Power MCU, 8KB Flash, 2KB SRAM, 16-QFN
MCU 32-bit KL03 ARM Cortex M0+ RISC 8KB Flash 1.8V/2.5V/3.3V 16-Pin QFN EP
Kinetis KL03 Series 8 kB Flash 2 kB RAM SMT 32-Bit Microcontroller - QFN-16
Product Range:kinetis Arm Cortex-M0+ Microcontrollers; Architecture:arm Cortex-M0+; No. Of Bits:32Bit; Cpu Speed:48Mhz; Program Memory Size:8Kb; Ram Memory Size:2Kb; No. Of Pins:16Pins; Mcu Case Style:qfn; No. Of I/o S:14I/o S Rohs Compliant: Yes
Device Core = ARM® Cortex® M0+ / Data Bus Width Bit = 32 / Instruction Set Architecture = RISC / Family Name = Kinetis / Clock Frequency Max. MHz = 48 / Program Memory Type = Flash / Program Memory Size KB = 8 / RAM Memory Size KB = 2 / Interfaces = I²C / Interfaces = SPI / Interfaces = UART / ADC Resolution Bit = 12 / DAC Resolution Bit = 6 / Number of Programmable I/Os = 14 / Number of Timers/Counters = 4 / Comparators = 1 / Supply Voltage Min. V = 1.71 / Supply Voltage Max. V = 3.6 / Operating Temperature Min. °C = -40 / Operating Temperature Max. °C = 105 / Package Type = HUQFN / Pins = 16 / Mounting Type = SMD / MSL = Level-3 / Packaging = Tray / Length mm = 3 / Width mm = 3 / Height mm = 0.65 / Reflow Temperature Max. °C = 260
Alias del produttore
NXP Semiconductors ha diversi marchi in tutto il mondo che i distributori possono utilizzare come nomi alternativi. NXP Semiconductors può anche essere conosciuto con i seguenti nomi:
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
Cronologia dell'inventario
Tendenza a 3 mesi: -0.64%
Modelli CAD
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Specifiche tecniche
Physical
Case/PackageQFN
Contact PlatingTin
MountSurface Mount
Number of Pins16
Number of Terminals16
Technical
ADC Channels (Resolution)1-Ch 12-Bit
Ambient Temperature Range High105 °C
Core ArchitectureARM Cortex-M0+
Data Bus Width32 b
EEPROM Memory Size0 B
Frequency48 MHz
InterfaceI2C, SPI, UART
Max Frequency24 MHz
Max Junction Temperature (Tj)125 °C
Max Operating Temperature105 °C
Max Supply Current6.82 mA
Max Supply Voltage3.6 V
Memory Size8 kB
Memory TypeFLASH
Min Operating Temperature-40 °C
Min Supply Voltage1.71 V
Number of A/D Converters1
Number of ADC Channels7
Number of I2C Channels1
Number of I/Os14
Number of Programmable I/O14
Number of PWM Channels2
Number of SPI Channels1
Number of Timers/Counters2
Number of UART Channels1
Operating Supply Voltage3.3 V
Oscillator TypeInternal
PackagingCut Tape
PeripheralsWDT
RAM Size2 kB
Schedule B8542310000
Temperature GradeIndustrial
Watchdog TimerYes
Dimensions
Height650 µm
Length3 mm
Terminal Pitch500 µm
Width3 mm
Schede tecniche e documenti
Scarica le schede tecniche e la documentazione del produttore per NXP Semiconductors MKL03Z8VFG4.
Conformità
Classificazione ambientale
China RoHSCompliant
REACH SVHCYes
RoHSCompliant
Dichiarazioni di conformità