NXP Semiconductors MK10DN512ZVMC10
NRND
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Schede tecniche e documenti
Scarica le schede tecniche e la documentazione del produttore per NXP Semiconductors MK10DN512ZVMC10.
Supply Chain
Country of OriginMainland China, Malaysia
Export Control Classification Number (ECCN) Code3A991.A.2
Harmonized Tariff Schedule (HTS) Code8542.31.00.01
Introduction Date2011-05-13
Lifecycle StatusNRND (Last Updated: 2 weeks ago)
Parti correlate
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MCU 32-bit Kinetis K22 ARM Cortex M4 RISC 512KB Flash 2.5V/3.3V 121-Pin MAP-BGA
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MCU 32-Bit K22 ARM Cortex M4 RISC 128KB Flash 1.8V/2.5V/3.3V 121-Pin XF-BGA Tray
STMicroelectronicsSTM32F103VEH6
MCU 32-bit ARM Cortex M3 RISC 512KB Flash 2.5V/3.3V 100-Pin LFBGA Frame
STMicroelectronicsSTM32F103ZEH7
MCU 32-bit STM32F ARM Cortex M3 RISC 512KB Flash 2.5V/3.3V 144-Pin LF-BGA Tray
STMicroelectronicsSTM32F103VEH7
MCU 32-bit STM32F ARM Cortex M3 RISC 512KB Flash 2.5V/3.3V 100-Pin LF-BGA Tray
Descrizioni
Descrizioni di NXP Semiconductors MK10DN512ZVMC10 fornite dai suoi distributori.
MCU 32-Bit/64-Bit K10 ARM Cortex M4 RISC 512KB Flash 1.8V/2.5V/3.3V 121-Pin MAP-BGA Tray
Kinetis K10: 100MHz Cortex-M4 Performance MCU, 512KB Flash, 128KB SRAM, 121-MAPBGA
RISC Microcontroller, 32-Bit, FLASH, CORTEX-M4 CPU, 100MHz, CMOS, PBGA121
NXP MK10DN512ZVMC10 32 Bit Microcontroller, ARM Cortex-M4, 100 MHz, 512 KB, 128 KB, 121 Pins, MAPBGA
IC 32BIT MCU KINETIS K10 100MHZ 121-MAPBGA; Controller Family/Series:(ARM Cortex) Kinetis; Core Size:32bit; No. of I/O's:104; Program Memory Size:512 KB; RAM Memory Size:128KB; CPU Speed:100MHz; Oscillator Type:External, Internal ;RoHS Compliant: Yes
MCU, KINETIS, K10, CORTEX M4, 121MAP; Controller Family/Series:(ARM Cortex - M4) Kinetis K10; Core Size:32bit; No. of I/O's:90; Supply Voltage Range:1.71V to 3.6V; Digital IC Case Style:MAPBGA; No. of Pins:121; Program Memory Size:512KB; RAM Memory Size:128KB; CPU Speed:100MHz; Oscillator Type:External, Internal; No. of Timers:3; Peripherals:ADC, Comparator, DAC, DMA, PWM, Timer; Embedded Interface Type:CAN, I2C, I2S, SPI, UART; Operating Temperature Range:-40°C to +105°C; MSL:MSL 3 - 168 hours; SVHC:No SVHC (18-Jun-2012)
Alias del produttore
NXP Semiconductors ha diversi marchi in tutto il mondo che i distributori possono utilizzare come nomi alternativi. NXP Semiconductors può anche essere conosciuto con i seguenti nomi:
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
Specifiche tecniche
Physical
Case/PackageLFBGA
MountSurface Mount
Number of Pins121
Number of Terminals121
Weight167.687429 mg
Technical
Core ArchitectureARM
Data Bus Width32 b
Frequency100 MHz
InterfaceCAN, EBI/EMI, I2C, I2S, IrDA, SPI, UART, USART
Max Frequency50 MHz
Max Operating Temperature105 °C
Max Supply Current87 mA
Max Supply Voltage3.6 V
Memory Size512 kB
Memory TypeFLASH
Min Operating Temperature-40 °C
Min Supply Voltage1.71 V
Number of I/Os75
Number of Programmable I/O90
Number of Timers/Counters14
Operating Supply Voltage3.3 V
Oscillator TypeInternal
PeripheralsDMA, LVD, POR, PWM, WDT
RAM Size128 kB
Temperature GradeIndustrial
Watchdog TimerYes
Dimensions
Height - Seated (Max)1.52 mm
Length8 mm
Terminal Pitch650 µm
Width8 mm
Schede tecniche e documenti
Scarica le schede tecniche e la documentazione del produttore per NXP Semiconductors MK10DN512ZVMC10.
Conformità
Classificazione ambientale
China RoHSCompliant
Radiation HardeningNo
REACH SVHCYes
RoHSCompliant
Dichiarazioni di conformità