NXP Semiconductors MCIMX6U7CVM08AB
$ 45.26
NRND
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Cronologia dell'inventario
Tendenza a 3 mesi: -36.52%
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Supply Chain
Export Control Classification Number (ECCN) Code5A992
Harmonized Tariff Schedule (HTS) Code8542.31.00.01
Introduction Date2012-11-12
Lifecycle StatusNRND (Last Updated: 2 weeks ago)
Parti correlate
NXP SemiconductorsMCIMX6S7CVM08AC
Microprocessor, ARM Cortex-A9, i.MX 6Solo Series, 800 MHz, 1.275 V to 1.5 V, MAPBGA-624
NXP SemiconductorsMCIMX6S6AVM08AC
Microprocessor, ARM Cortex-A9, i.MX 6Solo Series, 800 MHz, 1.275 V to 1.5 V, MAPBGA-624
NXP SemiconductorsMCIMX6S7CVM08AB
Microprocessor, ARM Cortex-A9, i.MX 6Solo Series, 800 MHz, 32bit, 1.275 V to 1.5 V, MAPBGA-624
Descrizioni
Descrizioni di NXP Semiconductors MCIMX6U7CVM08AB fornite dai suoi distributori.
Microprocessor, ARM Cortex-A9, i.MX 6DualLite Series, 800 MHz, 1.275 V to 1.5 V, MAPBGA-624
I.mx 6 Series 32-Bit Mpu, Dual Arm Cortex-A9 Core, 800Mhz, Mapbga 624 Rohs Compliant: Yes
RISC Microprocessor, 32-Bit, 800MHz, CMOS, PBGA624
FLOATING POINT MICROPROCESSOR RISC USB 2.0 + PHY (4) BALL IC Microprocessor -40C~105C TA 21mm 1.275V 800MHz
SOC i.MX 6DualLite ARM Cortex-A9 0.04um 624-Pin MAP-BGA Tray
IC MPU I.MX6DL 800MHZ 624MAPBGA
IC MPU 32BIT ROMLESS 624MAPBGA
Microprocessors - MPU i.MX6 DualLite
Processors - Application Specialized i.MX6 DualLite
MPU, CORTEX A9, IMX6Q, 624 MAP
Alias del produttore
NXP Semiconductors ha diversi marchi in tutto il mondo che i distributori possono utilizzare come nomi alternativi. NXP Semiconductors può anche essere conosciuto con i seguenti nomi:
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
Cronologia dell'inventario
Tendenza a 3 mesi: -36.52%
Modelli CAD
Scarica il simbolo, l'impronta e il 3D STEP
Parti alternative
0 parti disponibili
Specifiche tecniche
Physical
Case/PackageLFBGA
Contact PlatingCopper, Silver, Tin
MountSurface Mount
Number of Pins624
Number of Terminals624
Weight1.25251 g
Technical
Core ArchitectureARM
Data Bus Width32 b
Frequency800 MHz
InterfaceCAN, Ethernet, I2C, I2S, PCIe, SPI, UART, USB
Max Frequency800 MHz
Max Operating Temperature105 °C
Max Supply Current2.2 A
Max Supply Voltage1.5 V
Memory Size96 kB
Memory TypeL2 Cache, ROM, ROMless, SRAM
Min Operating Temperature-40 °C
Min Supply Voltage1.275 V
Number of Cores2
Number of Ethernet Channels1
Number of I2C Channels4
Number of PWM Channels4
Number of SPI Channels4
Number of Timers/Counters2
Number of UART Channels5
Number of USB Channels4
RAM Size128 kB
Temperature GradeIndustrial
Dimensions
Height1.3 mm
Height - Seated (Max)1.5 mm
Length21 mm
Terminal Pitch800 µm
Width21 mm
Conformità
Classificazione ambientale
China RoHSCompliant
Halogen FreeHalogen Free
Radiation HardeningNo
REACH SVHCYes
RoHSCompliant
Dichiarazioni di conformità