NXP Semiconductors MCIMX6S1AVM08AB
$ 30.338
NRND
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Cronologia dell'inventario
Tendenza a 3 mesi: +0.00%
Modelli CAD
Scarica il simbolo, l'impronta e il 3D STEP
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Supply Chain
Country of OriginMainland China
Export Control Classification Number (ECCN) Code5A992.C
Harmonized Tariff Schedule (HTS) Code8542.31.00.01
Introduction Date2012-11-12
Lifecycle StatusNRND (Last Updated: 2 weeks ago)
Parti correlate
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Microprocessor, ARM Cortex-A9, i.MX 6Solo Series, 800 MHz, 1.275 V to 1.5 V, MAPBGA-624
NXP SemiconductorsMCIMX6U7CVM08AC
Microprocessor, ARM Cortex-A9, i.MX 6DualLite Series, 800 MHz, 1.275 V to 1.5 V, MAPBGA-624
NXP SemiconductorsMCIMX6S6AVM08AC
Microprocessor, ARM Cortex-A9, i.MX 6Solo Series, 800 MHz, 1.275 V to 1.5 V, MAPBGA-624
Descrizioni
Descrizioni di NXP Semiconductors MCIMX6S1AVM08AB fornite dai suoi distributori.
Microprocessors - MPU i.MX 6 series 32-bit MPU, ARM Cortex-A9 core, 800MHz, MAPBGA 624
Microprocessor, i.MX 6Solo Series, 800 MHz, 1.275 V to 1.5 V, MAPBGA-624
NXP MCIMX6S1AVM08AB MPU, 32BIT, 800MHZ, MAPBGA-624
SOC i.MX6 ARM Cortex-A9 0.04um 624-Pin MAP-BGA
IC MPU I.MX6S 800MHZ 624MAPBGA
IC EPROM 2MBIT PARALLEL 44PLCC
MPU, 32BIT, 800MHZ, MAPBGA-624; Product Range: i.MX Family i.MX 6Solo Series Microprocessors; MPU Core Size: 32bit; Program Memory Size: -; No. of Pins: 624Pins; MPU Case Style: MAPBGA; Supply Voltage Min: 1.275V; Supply Volta
Alias del produttore
NXP Semiconductors ha diversi marchi in tutto il mondo che i distributori possono utilizzare come nomi alternativi. NXP Semiconductors può anche essere conosciuto con i seguenti nomi:
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
Cronologia dell'inventario
Tendenza a 3 mesi: +0.00%
Modelli CAD
Scarica il simbolo, l'impronta e il 3D STEP
Parti alternative
0 parti disponibili
Specifiche tecniche
Physical
Case/PackageLFBGA
MountSurface Mount
Number of Pins624
Number of Terminals624
Weight1.25251 g
Technical
Core ArchitectureARM
Data Bus Width32 b
Frequency800 MHz
InterfaceCAN, EBI/EMI, Ethernet, I2C, I2S, MMC, PCI, PCIe, SD, SPI, UART, USB
Max Frequency24 MHz
Max Operating Temperature125 °C
Max Supply Current2.2 A
Max Supply Voltage1.5 V
Memory Size96 kB
Memory TypeExternal Program Memory, L2 Cache, ROM, SRAM
Min Operating Temperature-40 °C
Min Supply Voltage1.275 V
Number of I/Os224
Number of Timers/Counters4
Operating Supply Voltage1.35 V
Oscillator TypeInternal
PackagingCut Tape
PeripheralsDMA, PWM, WDT
RAM Size128 kB
Temperature GradeAutomotive
Dimensions
Height - Seated (Max)1.5 mm
Length21 mm
Terminal Pitch800 µm
Width21 mm
Conformità
Classificazione ambientale
China RoHSCompliant
Halogen FreeHalogen Free
Radiation HardeningNo
REACH SVHCYes
RoHSCompliant
Dichiarazioni di conformità