NXP Semiconductors MCIMX6L3EVN10AB
$ 22.545
NRND
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Cronologia dell'inventario
Tendenza a 3 mesi: -46.59%
Modelli CAD
Scarica il simbolo, l'impronta e il 3D STEP
Parti alternative
0 parti disponibili
Supply Chain
Export Control Classification Number (ECCN) Code5A992.C
Harmonized Tariff Schedule (HTS) Code8542.31.00.01
Introduction Date2013-05-14
Lifecycle StatusNRND (Last Updated: 2 weeks ago)
Parti correlate
NXP SemiconductorsMCIMX6L3DVN10AA
SOC i.MX 6SoloLite ARM Cortex-A9 0.04um 432-Pin MAP-BGA Tray
NXP SemiconductorsMCIMX6L2EVN10AA
SOC i.MX 6SoloLite ARM Cortex-A9 0.04um 432-Pin MAP-BGA Tray
NXP SemiconductorsMCIMX6L3DVN10AB
Microprocessor, i.MX Family i.MX 6 Series, 32bit, 1GHz, 1.375V to 1.5V, TFBGA-432
MicrochipAT91SAM9263B-CU-100
MCU 32-bit SAM9X ARM926EJ-S RISC 128KB ROM 1.8V/2.5V/3.3V 324-Pin TFBGA
MicrochipAT91SAM9G45C-CU
MCU 32-bit AT91 ARM926EJ-S RISC 64KB ROM 1.65/3V 324-Pin TF-BGA Tray - Trays
MicrochipAT91SAM9M10C-CU
MPU SAM9M10 RISC 32-Bit 400MHz 1.8V/3.3V 324-Pin TF-BGA Tray - Trays
Descrizioni
Descrizioni di NXP Semiconductors MCIMX6L3EVN10AB fornite dai suoi distributori.
MPU i.MX 6SoloLite RISC 32Bit 1000MHz 1.975V/3.6V 432-Pin MAPBGA Tray
I.mx 6 Series 32-Bit Mpu, Arm Cortex-A9 Core, 1Ghz, Mapbga 432/ Tray Rohs Compliant: Yes |NXP Semiconductors MCIMX6L3EVN10AB
SOC i.MX 6SoloLite ARM Cortex A9 0.04um 432-Pin MAP-BGA Tray
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
MCIMX6L - i.MX 6 series 32-bit M
Alias del produttore
NXP Semiconductors ha diversi marchi in tutto il mondo che i distributori possono utilizzare come nomi alternativi. NXP Semiconductors può anche essere conosciuto con i seguenti nomi:
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
Cronologia dell'inventario
Tendenza a 3 mesi: -46.59%
Modelli CAD
Scarica il simbolo, l'impronta e il 3D STEP
Parti alternative
0 parti disponibili
Specifiche tecniche
Physical
Case/PackageTFBGA
Contact PlatingCopper, Silver, Tin
MountSurface Mount
Number of Pins432
Number of Terminals432
Weight587.912411 mg
Technical
Core ArchitectureARM
Data Bus Width32 b
Frequency1 GHz
InterfaceCAN, I2C, I2S, UART, USB
Max Frequency1 GHz
Max Operating Temperature105 °C
Max Supply Voltage1.5 V
Memory TypeL2 Cache, ROM, SRAM
Min Operating Temperature-40 °C
Min Supply Voltage1.375 V
Number of Cores1
Number of Timers/Counters2
Temperature GradeIndustrial
Dimensions
Height - Seated (Max)1.1 mm
Length13 mm
Terminal Pitch500 µm
Width13 mm
Conformità
Classificazione ambientale
China RoHSCompliant
Halogen FreeHalogen Free
Radiation HardeningNo
REACH SVHCYes
RoHSCompliant
Dichiarazioni di conformità