NXP Semiconductors MCIMX351AVM4B
$ 27.4
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Cronologia dell'inventario
Tendenza a 3 mesi: +0.00%
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Supply Chain
Country of OriginMainland China
Export Control Classification Number (ECCN) Code5A992.C
Harmonized Tariff Schedule (HTS) Code8542.31.00.01
Introduction Date2008-10-20
Lifecycle StatusProduction (Last Updated: 2 weeks ago)
Parti correlate
NXP SemiconductorsMCIMX353DJQ5C
I.mx35 32-Bit Mpu, Arm1136Jf-S Core, 532Mhz, Mapbga 400 Rohs Compliant: Yes
Descrizioni
Descrizioni di NXP Semiconductors MCIMX351AVM4B fornite dai suoi distributori.
i.MX35 32-bit MPU, ARM1136JF-S core, 400MHz, MAPBGA 400
SOC i.MX35 ARM1136JF-S 0.09um Automotive 400-Pin MAP-BGA Tray
MPU, IMX35, MEDIA APPS PROC, MAPBGA
IC MPU 32BIT ROMLESS 400MAPBGA
IC MPU I.MX35 400MHZ 400MAPBGA
Applications Processor 400-Pin MAPBGA Tray
USB 2.0 + PHY (2) 400MHz L1/L2 CACHE,ROM,SRAM 1 1.22V 400MHz 16KB 1.8V,2V,2.5V,2.7V,3V,3.3V 1-Wire,ASRC,ATA,CAN,I2C,I2S,MMC,SAI,SDHC,SDIO,SPI,SSI,UART 10Mbps,100Mbps 32bit ARM1136JF-S ;VFP MAPBGA-400 17mm*17mm*1.18mm
MPU, IMX35, MEDIA APPS PROC, MAPBGA; Series:i.MX35; Core Size:32bit; Program Memory Size:32 KB; CPU Speed:400MHz; Digital IC Case Style:MAPBGA; No. of Pins:400; Supply Voltage Range:1.22V to 1.47V; Operating Temperature Range:-40°C to +85°C; MSL:MSL 3 - 168 hours; SVHC:No SVHC (20-Jun-2011); Cache on Chip L1/L2 Memory:160KB; Frequency Typ:400MHz; Interface Type:1-Wire, CAN, I2C, I2S, JTAG, SPI, SSI, UART, USB; Package / Case:MAPBGA; Supply Voltage Max:1.47V; Supply Voltage Min:1.22V; Termination Type:SMD
Alias del produttore
NXP Semiconductors ha diversi marchi in tutto il mondo che i distributori possono utilizzare come nomi alternativi. NXP Semiconductors può anche essere conosciuto con i seguenti nomi:
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
Cronologia dell'inventario
Tendenza a 3 mesi: +0.00%
Modelli CAD
Scarica il simbolo, l'impronta e il 3D STEP
Parti alternative
0 parti disponibili
Specifiche tecniche
Physical
Case/PackageLFBGA
MountSurface Mount
Number of Pins400
Number of Terminals400
Weight838.692292 mg
Technical
Core ArchitectureARM
Data Bus Width32 b
Frequency400 MHz
InterfaceCAN, I2C, I2S, SPI, UART, USB
Max Operating Temperature85 °C
Max Supply Voltage1.47 V
Memory Size32 kB
Memory TypeL2 Cache, ROM, SRAM
Min Operating Temperature-40 °C
Min Supply Voltage1.22 V
Number of Cores1
Operating Supply Voltage1.8 V
Temperature GradeIndustrial
TerminationSMD/SMT
Dimensions
Height - Seated (Max)1.6 mm
Length17 mm
Terminal Pitch800 µm
Width17 mm
Conformità
Classificazione ambientale
China RoHSCompliant
Halogen FreeHalogen Free
Radiation HardeningNo
RatingsAEC-Q100
REACH SVHCYes
RoHSCompliant
Dichiarazioni di conformità