NXP Semiconductors MCIMX281AVM4B
$ 17.96
NRND
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Cronologia dell'inventario
Tendenza a 3 mesi: -0.39%
Modelli CAD
Scarica il simbolo, l'impronta e il 3D STEP
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0 parti disponibili
Supply Chain
Country of OriginMainland China
Export Control Classification Number (ECCN) Code5A002.A
Harmonized Tariff Schedule (HTS) Code8542.31.00.01
Introduction Date2011-05-13
Lifecycle StatusNRND (Last Updated: 2 weeks ago)
Parti correlate
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SOC i.MX28 ARM926EJ-S 0.08um 289-Pin MAP-BGA Tray / IC MPU I.MX28 454MHZ 289MAPBGA
NXP SemiconductorsMCIMX280CVM4B
Processors Data Sheet for Consumer Products | IC MPU I.MX28 454MHZ 289MAPBGA
NXP SemiconductorsMCIMX283CVM4B
SOC i.MX28 ARM926EJ-S 0.08um 289-Pin MAP-BGA Tray / IC MPU I.MX28 454MHZ 289MAPBGA
Descrizioni
Descrizioni di NXP Semiconductors MCIMX281AVM4B fornite dai suoi distributori.
Microprocessor, i.MX28 Series, 454 MHz, 1.62 V to 2.1 V, MAPBGA-289
i.MX28 ARM926EJ-S Core 454MHz 32-Bit Microprocessor - MAPBGA-289
SOC i.MX28 ARM926EJ-S 0.08um 289-Pin BGA Tray
IC MPU 32BIT ROMLESS 289MAPBGA
IC MPU I.MX28 454MHZ 289MAPBGA
Microprocessors - MPU CATSKILLS REV 1.2
Processors - Application Specialized CATSKILLS REV 1.2
MPU, ARM9, 32BIT, 454MHZ, MAPBGA-289; Product Range: i.MX Family i.MX28 Series Microprocessors; MPU Core Size: 32bit; Program Memory Size: 128KB; No. of Pins: 289Pins; MPU Case Style: MAPBGA; Supply Voltage Min: 1.62V; Supply
Alias del produttore
NXP Semiconductors ha diversi marchi in tutto il mondo che i distributori possono utilizzare come nomi alternativi. NXP Semiconductors può anche essere conosciuto con i seguenti nomi:
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
Cronologia dell'inventario
Tendenza a 3 mesi: -0.39%
Modelli CAD
Scarica il simbolo, l'impronta e il 3D STEP
Parti alternative
0 parti disponibili
Specifiche tecniche
Physical
Case/PackageLFBGA
MountSurface Mount
Number of Pins289
Number of Terminals289
Weight465.414121 mg
Technical
Core ArchitectureARM
Data Bus Width32 b
Frequency454 MHz
InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SPI, UART, USART, USB
Max Frequency454 MHz
Max Operating Temperature85 °C
Max Supply Voltage1.55 V
Memory Size128 kB
Memory TypeMask ROM, ROM, SRAM
Min Operating Temperature-40 °C
Min Supply Voltage1.35 V
Number of ADC Channels16
Number of Cores1
Number of Ethernet Channels1
Number of I2C Channels2
Number of PWM Channels8
Number of SPI Channels4
Number of Timers/Counters4
Number of UART Channels5
Number of USB Channels1
Operating Supply Voltage1.45 V
Oscillator TypeExternal
PeripheralsDMA, LCD, POR, PWM, WDT
RAM Size128 kB
Schedule B8542310000
Temperature GradeIndustrial
Dimensions
Height1.03 mm
Height - Seated (Max)1.37 mm
Length14 mm
Terminal Pitch800 µm
Width14 mm
Conformità
Classificazione ambientale
China RoHSCompliant
Halogen FreeHalogen Free
Radiation HardeningNo
RatingsAEC-Q100
REACH SVHCYes
RoHSCompliant
Dichiarazioni di conformità