NXP Semiconductors LPC812M101JDH20FP
$ 0.985
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Cronologia dell'inventario
Tendenza a 3 mesi: -26.18%
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Supply Chain
Country of OriginThailand
Export Control Classification Number (ECCN) Code3A991.A.2
Harmonized Tariff Schedule (HTS) Code8542.31.00.25
Introduction Date2012-11-12
Lifecycle StatusProduction (Last Updated: 1 month ago)
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IC, MCU, 8-Bit, 14KB, RAM, 1KB, 8MIPS, Timers, 4x8-Bit, 1x16-Bit, A/D, 8-Ch, 10-Bit, TSSOP-14
MicrochipPIC16F1824-I/ST
7KB 1.8V~5.5V PIC 32MHz 11 TSSOP-14 Microcontroller Units (MCUs/MPUs/SOCs) ROHS
Descrizioni
Descrizioni di NXP Semiconductors LPC812M101JDH20FP fornite dai suoi distributori.
MCU 32-bit ARM Cortex M0+ RISC 16KB Flash 3.3V 20-Pin TSSOP Tube
16KB 1.8V~3.6V ARM-MSeries 30MHz 18 TSSOP-20 Microcontroller Units (MCUs/MPUs/SOCs) ROHS
RISC Microcontroller, 32-Bit, FLASH, CORTEX-M0 CPU, 30MHz, CMOS, PDSO20
ARM MCU, LPC Family LPC81x Series Microcontrollers, ARM Cortex-M0+, 32 bit, 30 MHz, 16 KB, 20 Pins
ARM Microcontrollers - MCU 32-bit ARM CortexM0+ Microcontroller
ARM-MSeries 30MHz TSSOP-20 Microcontrollers (MCU/MPU/SOC) ROHS
Low Cost 32-bit Microcontroller based on ARM Cortex-M0+
NXP Semiconductors SCT
MCU, 32BIT, CORTEX-M0+, 30MHZ, TSSOP-20; Product Range: LPC Family LPC81x Series Microcontrollers; Architecture: ARM Cortex-M0+; No. of Bits: 32bit; CPU Speed: 30MHz; Program Memory Size: 16KB; RAM Memory Size: 4KB; No. of Pin
Alias del produttore
NXP Semiconductors ha diversi marchi in tutto il mondo che i distributori possono utilizzare come nomi alternativi. NXP Semiconductors può anche essere conosciuto con i seguenti nomi:
- NXP
- PHILIPS
- PHIL
- NXP USA Inc
- PHI
- PHILLIPS
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- NXP/PHILIPS
- PHILIPS SEMICONDUCTOR
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- NXP / Freescale
- PHILL
- PHILIPS ECG
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
Cronologia dell'inventario
Tendenza a 3 mesi: -26.18%
Modelli CAD
Scarica il simbolo, l'impronta e il 3D STEP
Parti alternative
0 parti disponibili
Specifiche tecniche
Physical
Case/PackageTSSOP
Contact PlatingGold
MountSurface Mount
Number of Pins20
Number of Terminals20
Technical
Core ArchitectureARM
Data Bus Width32 b
Frequency30 MHz
InterfaceI2C, SPI, UART, USART
Max Frequency25 MHz
Max Operating Temperature105 °C
Max Power Dissipation1.5 W
Max Supply Voltage3.6 V
Memory Size16 kB
Memory TypeFLASH
Min Operating Temperature-40 °C
Min Supply Voltage1.8 V
Number of I/Os18
Number of Programmable I/O18
Number of Timers/Counters3
Operating Supply Voltage3.3 V
Oscillator TypeInternal
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
RAM Size4 kB
Schedule B8542310000
Temperature GradeIndustrial
Watchdog TimerYes
Dimensions
Height - Seated (Max)1.1 mm
Length6.5 mm
Terminal Pitch650 µm
Width4.4 mm
Conformità
Classificazione ambientale
China RoHSCompliant
Lead FreeLead Free
Radiation HardeningNo
REACH SVHCYes
RoHSCompliant
Dichiarazioni di conformità