Molex 52991-0308
$ 0.938
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SKU
Min
Pkg
Prezzi all'ingrosso
Cronologia dell'inventario
Tendenza a 3 mesi: -41.15%
Modelli CAD
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0 parti disponibili
Modelli CAD
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Supply Chain
Country of OriginUS
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8536.69.40.40
Introduction Date2010-04-20
Lifecycle StatusProduction (Last Updated: 6 years ago)
Manufacturer Lifecycle StatusACTIVE (Last Updated: 6 years ago)
Parti correlate
HIROSE ELECTRICDF12B-30DS-0.5V(86)
Conn Board to Board RCP 30 POS 0.5mm Solder ST SMD Embossed T/R
HIROSE ELECTRICDF40C-30DS-0.4V(51)
0.4mm 2 -35℃~+85℃ Standing paste 300mA SMD,P=0.4mm Board-to-Board and Backplane Connector ROHS
Molex505066-3010
Board-to-Board Receptacle Assy, SlimStack Armor, SMD, 0.35mm Pitch, Dual Row, 30CKT, 13T/R"
HIROSE ELECTRICDF30FC-24DS-0.4V(82)
24 Position Connector Receptacle, Outer Shroud Contacts Surface Mount Gold
Molex501864-3091
FFC/FPC Connector Socket 30 Position 0.5 mm Solder Right Angle Surface Mount Emboss T/R
Molex501044-3010
Detent Lock，Receptacle 1 30pin Center Strip Contact Black SMD mount 16.74mm*1.143mm*4.2mm
Descrizioni
Descrizioni di Molex 52991-0308 fornite dai suoi distributori.
Board to Board & Mezzanine Connectors 30 Ckt Vert. Recept 0.5mm SMT Dual-Row
Board Connector, 30 Contact(s), 2 Row(s), Female, Straight, 0.02 inch Pitch, Surface Mount Terminal, Locking, White Insulator, Receptacle
0.50mm Pitch SlimStack Receptacle, Surface Mount, Dual Row, Vertical, 3.00 and 4.00mm Stacking Heights, Lower Circuit Size Version, White, 30 Circuits
MEZZANINE CONN, RCPT, 30POS, 2ROW, 0.5MM; Product Range: SlimStack 52991 Series; No. of Contacts: 30Contacts; Gender: Receptacle; Pitch Spacing: 0.5mm; Contact Term; Available until stocks are exhausted Alternative available
Alias del produttore
Molex ha diversi marchi in tutto il mondo che i distributori possono utilizzare come nomi alternativi. Molex può anche essere conosciuto con i seguenti nomi:
- MOLEX INC
- MOL
- MLX
- Molex LLC
- Molex Connector Corporation
- MOLE
- MOLX
- MOLEX INCORPORATED
- MOLEX ELECTRONICS
- MOLEX CONNECTOR CORP
- MOLEX HONG KONG CHINA LTD
- MOLEX INTERCONNECT GMBH
- Molex / FCT
- MXA
- Molex Taiwan Ltd
- Molex - Oplink Communications LLC
- MOLEX-ETC
- MOLEX PREMISE NETWORK
- MOLEX GMBH
- MOLEX INDUSTRIAL HDC
- MOELX
- MOLEX INDUSTRIAL
- MOLEX ELEKTRONIK GMBH
- MOLEX INTERCONNECT
- MOLEX CONNECTOR
- Molex, LLC
Cronologia dell'inventario
Tendenza a 3 mesi: -41.15%
Modelli CAD
Scarica il simbolo, l'impronta e il 3D STEP
Parti alternative
0 parti disponibili
Specifiche tecniche
Physical
Contact MaterialGold
Contact PlatingGold
Housing MaterialPolymer
Insulation ColorWhite
MountSurface Mount
Number of Pins30
PlatingGold
Technical
Contact Resistance70 mΩ
Current Rating500 mA
GenderFemale
Insulation Resistance100 MΩ
Max Operating Temperature105 °C
Min Operating Temperature-40 °C
Number of Circuits20
Number of Contacts30
Number of Positions30
Number of Rows2
OrientationVertical
PackagingCut Tape
Plating Thickness101.6 nm
Schedule B8536694040
TerminationSMD/SMT, Solder
Voltage Rating50 V
Voltage Rating (DC)50 V
Dimensions
Height2.47 mm
Lead Pitch500 µm
Length11.3 mm
Pitch508 µm
Row Spacing3.9878 mm
Terminal Pitch500 µm
Width5.4 mm
Conformità
Classificazione ambientale
China RoHSCompliant
ELVCompliant
Glow Wire CompliantNon-compliant
Halogen FreeLow Halogen
Lead FreeLead Free
Radiation HardeningNo
REACH SVHCYes
RoHSCompliant
Dichiarazioni di conformità