Microchip M2S090TS-1FGG484I
$ 298.2
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| Distributor | SKU | Min | Pkg | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| DigiKey | M2S090TS-1FGG484I-ND | 58 | 1 | Tray | ||||||||
| TME | M2S090TS-1FGG484I | 0 | 60 | 13h | ||||||||
| Microchip | M2S090TS-1FGG484I | 7 | 60 | Tray | 7h | |||||||
| Newark | M2S090TS-1FGG484I | 0 | 60 | |||||||||
| Onlinecomponents.com | M2S090TS-1FGG484I | 0 | 15 | Bulk |
Cronologia dell'inventario
Tendenza a 3 mesi: -10.64%
Modelli CAD
Scarica il simbolo, l'impronta e il 3D STEP
Parti alternative
0 parti disponibili
Supply Chain
Projected EOL Date2049-02-04
Country of AssemblySouth Korea
Country of FabricationSingapore
Country of OriginSouth Korea
Export Control Classification Number (ECCN) Code5A992.c
Harmonized Tariff Schedule (HTS) Code8542.31.0070
Lifecycle StatusProduction (Last Updated: 1 day ago)
Manufacturer Lifecycle StatusREL (Last Updated: 1 day ago)
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Descrizioni
Descrizioni di Microchip M2S090TS-1FGG484I fornite dai suoi distributori.
M2S Series 64 kb RAM 512 kb Flash IGLOO2 & SmartFusion2 SoC FPGA - FPBGA-484
FPGA SmartFusion2 Family 86184 Cells 65nm Technology 1.2V 484-Pin FBGA Tray
SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs
Smartfusion2 Soc Fpga, Arm Cortex-M3, 86Kles 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip Technology M2S090TS-1FGG484I
Alias del produttore
Microchip ha diversi marchi in tutto il mondo che i distributori possono utilizzare come nomi alternativi. Microchip può anche essere conosciuto con i seguenti nomi:
- Microchip Technology
- MICROCHIP TECHNOLOGY INC
- MICROCHI
- MICROC
- MICROCH
- MICROCHIP TECH
- MCHP
- MCRCH
- MCP
- MICROHIP
- MICROSHIP
- MICCHP
- MICROCHP
- MTech
- Microchip Technology / Atmel
- MICROCIHIP
- Microchip Technologies
- Microchip / Microsemi
- MICORCHIP
- MICHROCHIP
- Atmel/Microchip
- MICRIOCHIP
- Atmel (Microchip Technology)
- MICROCHIP (ATMEL)
- MICROCHIP TECHNOLOGY (VA)
- Microchip Technology Inc.
Cronologia dell'inventario
Tendenza a 3 mesi: -10.64%
Modelli CAD
Scarica il simbolo, l'impronta e il 3D STEP
Parti alternative
0 parti disponibili
Specifiche tecniche
Physical
Case/PackageBGA
Number of Pins484
Technical
Core ArchitectureARM
Frequency166 MHz
HS Code8542.31.0070
InterfaceCAN, Ethernet, I2C, SPI, UART, USART, USB
Max Operating Temperature100 °C
Min Operating Temperature-40 °C
Number of I/Os267
PeripheralsDDR, PCIe, SERDES
Schedule B8542390000