AMD XC6SLX25-2FTG256C
$ 69.91
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Cronologia dell'inventario
Tendenza a 3 mesi: +61.50%
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Supply Chain
Country of OriginTaiwan
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.31.00.60
Introduction Date2009-06-24
Lifecycle StatusProduction (Last Updated: 3 months ago)
Parti correlate
Lattice SemiconductorLFE3-17EA-6FTN256C
ECP3 Series 17K Elements 2125 LABs 133 I/O 1.2 V FPGA - FTBGA-256
Lattice SemiconductorLFE3-17EA-8FTN256I
ECP3 Series 17.3 K LUTs 133 I/O 1.26 V Surface Mount FPGA - FTBGA - 256
Lattice SemiconductorLFE3-17EA-7FTN256C
FPGA LatticeECP3E Family 17000 Cells 65nm Technology 1.2V 256-Pin FTBGA Tray
FPGA XC6SLX25T Family 15032 Logic Units 24051 Cells 333MHz 1.2V 324-Pin CSBGA
FPGA Spartan-6 LXT Family 24051 Cells 45nm (CMOS) Technology 1.2V 324-Pin CS-BGA
FPGA Spartan-6 LXT Family 24051 Cells 45nm (CMOS) Technology 1.2V 324-Pin CS-BGA
Descrizioni
Descrizioni di AMD XC6SLX25-2FTG256C fornite dai suoi distributori.
FPGA Spartan-6 LX Family 24051 Cells 45nm (CMOS) Technology 1.2V 256-Pin FTBGA
Field Programmable Gate Array, 1879 CLBs, 667MHz, 24051-Cell, CMOS, PBGA256
936Kbit 24051 1879 1.14V 1.26V BGA-256 17mm*17mm*1.4mm
XILINX XC6SLX25-2FTG256CFPGA, SPARTAN-6 LX, 24K, 256FTGBGA
BGA-256 Programmable Logic Device (CPLDs/FPGAs) ROHS
Programmable Logic Device (CPLD/FPGA)
IC VREF SHUNT ADJ 0.48% SOT23-3
Alias del produttore
AMD ha diversi marchi in tutto il mondo che i distributori possono utilizzare come nomi alternativi. AMD può anche essere conosciuto con i seguenti nomi:
- MMI
- ADVANCED MICRO DEVICES
- AMC
- AMD Xilinx
- ADM
- Advanced Micro Devices (AMD)
- SPAN
- ADVANCED MICRO DEVICES INC
- AMT
- ADVANCED
- AMD (ADVANCED MICRO DEVICES)
- MONOLITHIC MEMORIES
- PALCE
- ADVANCED MICRO DEVIC
- AMD INC
- MONOLITHIC MEMORY INC
- BAE
- ADVANCED MICRO DEVICE
- SPN
- MONOLITHIC MEMO
- LOCKHEED
- AMD Advanced Micro Devices Inc
- Monolithic Memories Inc
- VANTIS
- AMD Advan
- Advanced Micro Devices (AMD)
Cronologia dell'inventario
Tendenza a 3 mesi: +61.50%
Modelli CAD
Scarica il simbolo, l'impronta e il 3D STEP
Parti alternative
0 parti disponibili
Specifiche tecniche
Physical
Case/PackageBGA
Contact PlatingCopper, Silver, Tin
MountSurface Mount
Number of Pins256
Number of Terminals256
Technical
Max Frequency667 MHz
Max Operating Temperature85 °C
Max Supply Voltage1.26 V
Min Operating Temperature0 °C
Min Supply Voltage1.14 V
Nominal Supply Voltage (DC)1.2 V
Number of I/Os186
Number of Inputs186
Number of Logic Blocks (LABs)1879
Number of Logic Elements/Cells24051
Number of Macrocells24051
Number of Outputs186
Number of Registers30064
Operating Supply Voltage1.2 V
RAM Size117 kB
Speed Grade2
Dimensions
Height - Seated (Max)1.55 mm
Length17 mm
Terminal Pitch1 mm
Width17 mm