AMD XC3SD1800A-4FGG676I
Obsolete
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Distributori autorizzati
Distributori di stock non autorizzati
Rivenditori non autorizzati
| Distributor | SKU | Min | Pkg | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Microchip USA | XC3SD1800A-4FGG676I | 342 | 20 | Tray | 1d | |||||||
| Worldway Electronics | XC3SD1800A-4FGG676I | 2099 | 7 | Tray | 1d | |||||||
| Component Stockers USA | XC3SD1800A-4FGG676I | 2 | 3d | |||||||||
| Weyland Electronics Group Pte. Ltd. | XC3SD1800A-4FGG676I | 186 | 1 | Tape & Reel | 1d | |||||||
| Win Source | WS-XC3SD1800A-4FGG676I | 186 | 1 | 8h |
Schede tecniche e documenti
Scarica le schede tecniche e la documentazione del produttore per AMD XC3SD1800A-4FGG676I.
Supply Chain
Country of OriginTaiwan
Harmonized Tariff Schedule (HTS) Code8542.31.00.60
Introduction Date2007-03-30
Lifecycle StatusObsolete (Last Updated: 1 month ago)
LTB Date2024-06-29
LTD Date2024-12-28
Parti correlate
FPGA Spartan-3 Family 2M Gates 46080 Cells 630MHz 90nm Technology 1.2V 676-Pin FBGA
FPGA Spartan-3 Family 2M Gates 46080 Cells 725MHz 90nm Technology 1.2V 676-Pin FBGA
FPGA Spartan-3 Family 1.5M Gates 29952 Cells 630MHz 90nm Technology 1.2V 676-Pin FBGA
Lattice SemiconductorLFE2-35E-5FN672C
FPGA LatticeECP2 Family 32000 Cells 90nm Technology 1.2V 672-Pin FBGA Tray
Lattice SemiconductorLFE2M35E-5FN672I
FPGA LatticeECP2M Family 34000 Cells 90nm (CMOS) Technology 1.2V 672-Pin FBGA
Lattice SemiconductorLFXP2-30E-6FN672C
Field Programmable Gate Array, 3635 CLBS, 435MHz, 29000-Cell, CMOS, PBGA672
Descrizioni
Descrizioni di AMD XC3SD1800A-4FGG676I fornite dai suoi distributori.
FPGA Spartan-3A DSP Family 1.8M Gates 37440 Cells 667MHz 90nm Technology 1.2V 676-Pin FBGA
Field Programmable Gate Array, 4160 CLBs, 1800000 Gates, 250MHz, 37440-Cell, CMOS, PBGA676
FPGA 4160 CLBS 1800000 GATES 250 MHz PBGA676
FPGA, SPARTAN-3ADSP, 1800K, 676FBGA
189KB 37440 4160 1.14V 1.26V BGA 27mm*27mm*2.6mm
MICROCIRCUIT/FPGA XILINX SPARTAN-3AD XC3
IC RF TXRX+MCU 802.15.4 125VFBGA
XC3SD1800A-4FGG676I ROHS COMPLIANT: YES
FPGA, SPARTAN-3ADSP, 1800K, 676FBGA; No. of Macrocells:37440; Operating Temperature Range:0°C to +100°C; No. of Pins:676; SVHC:No SVHC (18-Jun-2010); Package / Case:FBGA; Logic IC Base Number:3SD1800; Logic IC Function:FPGA; Supply Voltage Max:1.26V; Supply Voltage Min:1.14V; Termination Type:SMD; Frequency:667MHz; I/O Interface Standard:LVTTL, LVCMOS, HSTL, SSTL; I/O Output Drive:3.3V, 2.5V, 1.8V, 1.5V, 1.2V; No. of I/O Lines:519; Programmable Logic Type:FPGA
Alias del produttore
AMD ha diversi marchi in tutto il mondo che i distributori possono utilizzare come nomi alternativi. AMD può anche essere conosciuto con i seguenti nomi:
- MMI
- ADVANCED MICRO DEVICES
- AMC
- AMD Xilinx
- ADM
- Advanced Micro Devices (AMD)
- SPAN
- ADVANCED MICRO DEVICES INC
- AMT
- ADVANCED
- AMD (ADVANCED MICRO DEVICES)
- MONOLITHIC MEMORIES
- PALCE
- ADVANCED MICRO DEVIC
- AMD INC
- MONOLITHIC MEMORY INC
- BAE
- ADVANCED MICRO DEVICE
- SPN
- MONOLITHIC MEMO
- LOCKHEED
- AMD Advanced Micro Devices Inc
- Monolithic Memories Inc
- VANTIS
- AMD Advan
- Advanced Micro Devices (AMD)
Specifiche tecniche
Physical
Case/PackageBGA
MountSurface Mount
Number of Pins676
Number of Terminals676
Technical
Frequency667 MHz
Max Frequency250 MHz
Max Operating Temperature100 °C
Max Supply Voltage1.26 V
Min Operating Temperature-40 °C
Min Supply Voltage1.14 V
Number of Gates1.8e+06
Number of I/Os519
Number of Inputs519
Number of Logic Blocks (LABs)4160
Number of Logic Elements/Cells37440
Number of Macrocells37440
Number of Outputs409
Operating Supply Voltage1.2 V
RAM Size189 kB
Speed Grade4
TerminationSMD/SMT
Dimensions
Height - Seated (Max)2.6 mm
Length27 mm
Terminal Pitch1 mm
Width27 mm
Schede tecniche e documenti
Scarica le schede tecniche e la documentazione del produttore per AMD XC3SD1800A-4FGG676I.