AMD XC3S200-4FTG256C
$ 74.46
Obsolete
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| Distributor | SKU | Min | Pkg | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| DigiKey | 122-1338-ND | 2400 | 1 | Tray | ||||||||
| Microchip USA | XC3S200-4FTG256C | 1144 | 150 | Tray | 4d | |||||||
| Worldway Electronics | XC3S200-4FTG256C | 1956 | 7 | Tray | 3d | |||||||
| Weyland Electronics Group Pte. Ltd. | XC3S200-4FTG256C | 4900 | 1 | Tape & Reel | 3d | |||||||
| Win Source | WS-XC3S200-4FTG256C | 1000 | 2 | 23h |
Cronologia dell'inventario
Tendenza a 3 mesi: -1.67%
Modelli CAD
Scarica il simbolo, l'impronta e il 3D STEP
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Schede tecniche e documenti
Scarica le schede tecniche e la documentazione del produttore per AMD XC3S200-4FTG256C.
Supply Chain
Country of OriginTaiwan
Export Control Classification Number (ECCN) CodeEAR99
Harmonized Tariff Schedule (HTS) Code8542.31.00.60
Introduction Date1997-09-17
Lifecycle StatusObsolete (Last Updated: 1 month ago)
LTB Date2024-06-29
LTD Date2024-12-28
Parti correlate
XilinxXA3S200-4FTG256I
FPGA Spartan-3 Family 200K Gates 4320 Cells 90nm Technology 1.2V 256-Pin FTBGA
FPGA Spartan-3 Family 200K Gates 4320 Cells 725MHz 90nm Technology 1.2V 256-Pin FTBGA
XilinxXA3S200-4FTG256Q
FPGA Spartan-3 Family 200K Gates 4320 Cells 90nm Technology 1.2V 256-Pin FTBGA
Descrizioni
Descrizioni di AMD XC3S200-4FTG256C fornite dai suoi distributori.
FPGA Spartan-3 Family 200K Gates 4320 Cells 630MHz 90nm Technology 1.2V 256-Pin FTBGA
Field Programmable Gate Array, 480 CLBs, 200000 Gates, 630MHz, 4320-Cell, CMOS, PBGA256
200000 System Gate 1.2 Volt Fpga Rohs Compliant: Yes
FPGA 480 CLBS 200000 GATES 630 MHz PBGA256
Field Programmable Gate Array, 192 CLBs, 50000 Gates, PQFP208
216Kbit 4320 480 1.14V 1.26V FTBGA-256 17mm*17mm*1.4mm
IC SPARTAN-3 FPGA 200K 256-FTBGA
Programmable Logic Device (CPLD/FPGA)
MICROCIRCUIT/FPGA XILINX SPARTAN-3 XC3S2
Alias del produttore
AMD ha diversi marchi in tutto il mondo che i distributori possono utilizzare come nomi alternativi. AMD può anche essere conosciuto con i seguenti nomi:
- MMI
- ADVANCED MICRO DEVICES
- AMC
- AMD Xilinx
- ADM
- Advanced Micro Devices (AMD)
- SPAN
- ADVANCED MICRO DEVICES INC
- AMT
- ADVANCED
- AMD (ADVANCED MICRO DEVICES)
- MONOLITHIC MEMORIES
- PALCE
- ADVANCED MICRO DEVIC
- AMD INC
- MONOLITHIC MEMORY INC
- BAE
- ADVANCED MICRO DEVICE
- SPN
- MONOLITHIC MEMO
- LOCKHEED
- AMD Advanced Micro Devices Inc
- Monolithic Memories Inc
- VANTIS
- AMD Advan
- Advanced Micro Devices (AMD)
Cronologia dell'inventario
Tendenza a 3 mesi: -1.67%
Modelli CAD
Scarica il simbolo, l'impronta e il 3D STEP
Parti alternative
0 parti disponibili
Specifiche tecniche
Physical
MountSurface Mount
Number of Pins256
Number of Terminals256
Technical
Max Frequency630 MHz
Max Operating Temperature85 °C
Max Supply Voltage1.26 V
Min Operating Temperature0 °C
Min Supply Voltage1.14 V
Number of Gates200000
Number of I/Os173
Number of Inputs173
Number of Logic Blocks (LABs)480
Number of Logic Elements/Cells4320
Number of Outputs173
Operating Supply Voltage1.2 V
PackagingBulk
RAM Size27 kB
Speed Grade4
Dimensions
Height1 mm
Height - Seated (Max)1.55 mm
Length17 mm
Terminal Pitch1 mm
Width17 mm
Schede tecniche e documenti
Scarica le schede tecniche e la documentazione del produttore per AMD XC3S200-4FTG256C.