Advanced Thermal Solutions ATS-PCB1073

Heat Sinks BGA Heat Sink, Board Level Stamp, No TIM, Tin Plate, TO220, 12.7x26.2x10.21mm
$ 1.007
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Schede tecniche e documenti

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Sager Electronics

Datasheet29 pagine7 anni fa

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Descrizioni

Descrizioni di Advanced Thermal Solutions ATS-PCB1073 fornite dai suoi distributori.

Heat Sinks BGA Heat Sink, Board Level Stamp, No TIM, Tin Plate, TO220, 12.7x26.2x10.21mm
TO-263 Package 12.7 x 26.2 x 10.2 mm 9.5° C/W Board Level Stamped Heat Sink
Heat Sink Passive TO-263 U-Extruded Adhesive Copper 9.5C/W Tin
Standard Board Level Heat Sink
Heat Sink, 5Deg C/W, 0.5"x1.03"x0.4"; Thermal Resistance:5°C/W; Packages Cooled:To-263; External Width - Metric:26.2Mm; External Height - Metric:10.2Mm; External Length - Metric:12.7Mm; External Diameter - Metric:-; Product Range:- Rohs Compliant: Yes |Advanced Thermal Solutions ATS-PCB1073

Alias del produttore

Advanced Thermal Solutions ha diversi marchi in tutto il mondo che i distributori possono utilizzare come nomi alternativi. Advanced Thermal Solutions può anche essere conosciuto con i seguenti nomi:

  • Advanced Thermal Solutions Inc
  • ADVANCED THERMAL SOLUTION
  • ADVANCED THERMA
  • ADVANCED THERMAL
  • ADVANCED THERMAL PRODUCTS INC
  • Advanced Thermal Sol