AMD XC7Z045-3FFG900E
$ 3,423.205
Production
Precio y existencias
Distribuidores autorizados
Distribuidores no autorizados
Vendedores no autorizados
Historial de existencias
Tendencia de 3 meses: +33.33%
Modelos CAD
Descargar símbolo, footprint y 3D STEP
Componentes alternativos
0 piezas disponibles
Fichas técnicas y documentos
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Cadena de suministros
Export Control Classification Number (ECCN) Code3A991.D
Harmonized Tariff Schedule (HTS) Code8542.31.00.60
Introduction Date2012-09-19
Lifecycle StatusProduction (Last Updated: 1 month ago)
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Descripciones
Descripciones de AMD XC7Z045-3FFG900E suministradas por sus distribuidores.
MPU Zynq-7000 Thumb-2 32-Bit 1GHz 1.2V/3.3V 900-Pin FC-BGA
ICM,FPGA,XC7Z045,900BG,X 31X31mm,1.0mm BALL PITCH PROG SoC,DC&AC SWITCHING
FPGA SOC, 27325 CLBS, 350000-Cell, PBGA900
PSOC, ARM CORTEX-A9, 1GHZ, FCBGA-900
IC SOC CORTEX-A9 1GHZ 900FCBGA
IC SOC CORTEX-A9 KINTEX7 900FBGA
Programmable Logic Device (CPLD/FPGA)
Psoc, Arm Cortex-A9, 1Ghz, Fcbga-900; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:1Ghz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:900Pins; Mpu Family:Zynq; Mpu Series:7000; Automotive Rohs Compliant: Yes |Amd Xilinx XC7Z045-3FFG900E
Alias de fabricantes
AMD tiene diversas marcas a nivel mundial que los distribuidores pueden usar como nombres alternativos. AMD también podría ser conocido por los siguientes nombres:
- MMI
- ADVANCED MICRO DEVICES
- AMC
- AMD Xilinx
- ADM
- Advanced Micro Devices (AMD)
- SPAN
- ADVANCED MICRO DEVICES INC
- AMT
- ADVANCED
- AMD (ADVANCED MICRO DEVICES)
- MONOLITHIC MEMORIES
- PALCE
- ADVANCED MICRO DEVIC
- AMD INC
- MONOLITHIC MEMORY INC
- BAE
- ADVANCED MICRO DEVICE
- SPN
- MONOLITHIC MEMO
- LOCKHEED
- AMD Advanced Micro Devices Inc
- Monolithic Memories Inc
- VANTIS
- AMD Advan
- Advanced Micro Devices (AMD)
Historial de existencias
Tendencia de 3 meses: +33.33%
Modelos CAD
Descargar símbolo, footprint y 3D STEP
Componentes alternativos
0 piezas disponibles
Especificaciones técnicas
Physical
Case/PackageBGA
Contact PlatingCopper, Silver, Tin
Number of Terminals900
Technical
Core ArchitectureARM
Data Bus Width32 b
Frequency1 GHz
InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Frequency1 GHz
Max Operating Temperature100 °C
Max Supply Voltage1.05 V
Memory TypeROMless
Min Operating Temperature0 °C
Min Supply Voltage950 mV
Number of I/Os130
Number of Inputs490
Number of Logic Blocks (LABs)27325
Number of Logic Elements/Cells350000
Number of Outputs490
Operating Supply Voltage1 V
PeripheralsDMA
Speed Grade-3
Dimensions
Height - Seated (Max)3.24 mm
Length27 mm
Terminal Pitch1 mm
Width27 mm
Fichas técnicas y documentos
Descargar fichas técnicas y documentación del fabricante para AMD XC7Z045-3FFG900E.