Digi International DC-WME-01T-S
Technical Specifications
Physical
Case/PackageModule
MountSurface Mount
Technical
Core ArchitectureARM
Current - Receiving270 mA
Current - Transmitting270 mA
Data Rate11 Mbps
Frequency2.4 GHz
InterfaceSerial
Max Operating Temperature75 °C
Max Output Current650 mA
Memory Size8 MB
Min Operating Temperature-30 °C
Operating Supply Voltage3.3 V
PackagingBulk
RAM Size7.6 MB
Sensitivity (dBm)-92 dBm
Dimensions
Height21.69 mm
Length46.99 mm
Width19.05 mm
Inventory History
Inventory history trend unavailable
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
0 parts available
Engineering Resources
View Evaluation kits and Reference designs for Digi International DC-WME-01T-S.
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Descriptions
Descriptions of Digi International DC-WME-01T-S provided by its distributors.
Digi Connect Wi-ME Module w/8MB SDRAM, 4MB Flash, Standard firmware
WIFI MOD, WI-ME, 802.11B, ANTENNA; Frequency RF: 2.4GHz; Module Interface: Ethernet; Module Applications: RF Communications, Wireless Connectivity WiFi; Product Range: -; SVHC: No SVHC (15-Jan-2018); Development Tool Type: Embedded Module; Kit Features: No JTAG Interface, 10/100 BASE-T Ethernet Support or Wireless Interface; Type: Hardware - Daughter Card
Wireless Development Tools; Development Tool Type:Hardware - Daughter Card; Tool/Board Application:Wireless Connectivity-ZigBee, RF, Infrared, USB ;RoHS Compliant: Yes
Manufacturer Aliases
Digi International has several brands around the world that distributors may use as alternate names. Digi International may also be known as the following names:
- Digi
- DIGIINTL
- Digi International Inc
- DIGI INTERNATIO
- DIGI INTERNA
- DIGI INTER
- Digi International Ltd
- DGI
- Digi International Ltd (GBP)
- ACCELERATED/DIGI INTERNATIONAL
- DIGIINTERNATION
- DIGI INTERN
- DIGI INT
- Digi International Incorporated
- Digi International GmbH
Inventory History
Inventory history trend unavailable
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
0 parts available
Technical Specifications
Physical
Case/PackageModule
MountSurface Mount
Technical
Core ArchitectureARM
Current - Receiving270 mA
Current - Transmitting270 mA
Data Rate11 Mbps
Frequency2.4 GHz
InterfaceSerial
Max Operating Temperature75 °C
Max Output Current650 mA
Memory Size8 MB
Min Operating Temperature-30 °C
Operating Supply Voltage3.3 V
PackagingBulk
RAM Size7.6 MB
Sensitivity (dBm)-92 dBm
Dimensions
Height21.69 mm
Length46.99 mm
Width19.05 mm
Compliance
Environmental Classification
Lead FreeLead Free
Radiation HardeningNo
REACH SVHCUnknown
RoHSCompliant