NXP Semiconductors BB178,115
Technical Specifications
Physical
Contact PlatingTin
MountSurface Mount
Number of Pins2
Technical
Capacitance34.65 pF
Element ConfigurationSingle
Forward Current20 mA
Max Operating Temperature125 °C
Max Repetitive Reverse Voltage (Vrrm)35 V
Max Reverse Voltage (DC)32 V
Min Operating Temperature-55 °C
PackagingCut Tape
Reverse Voltage (DC)32 V
TerminationSMD/SMT
Dimensions
Height650 µm
Length1.25 mm
Width850 µm
Inventory History
3 month trend: +0.00%
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
0 parts available
Engineering Resources
View Evaluation kits and Reference designs for NXP Semiconductors BB178,115.
Descriptions
Descriptions of NXP Semiconductors BB178,115 provided by its distributors.
Tape & Reel (TR) Surface Mount Single 2 Varactors 2.754pF @ 28V 1MHz 15 32V 38.5pF
Diode VAR Cap Single 32V 34.65pF 2-Pin SOD-523 T/R
VHF-UHF BAND 38.5 pF 32 V SILICON VARIABLE CAPACITANCE DIODE
; No. of Pins:2; Forward Current Max, If:20mA
Var,Bb178(Was Bb133,Lf,So D079,Lf Eol
DIODE, VHF, VAR, CAP, 32V, SOD523; Capacitance Cd Max @ Vr F:42.35pF; Forward Current If(AV):20mA; Repetitive Reverse Voltage Vrrm Max:35V; Operating Temperature Range:-55°C to +125°C; Diode Case Style:SOD-523; No. of Pins:2; SVHC:No SVHC (19-Dec-2011); Capacitance @ VR1:42.35pF; Capacitance @ VR2:2.6pF; Capacitance Ratio Min Cvr1/Cvr2:15; Diode Type:Variable Capacitance; Package / Case:SOD-523; Peak Forward Current:20mA; Reverse Voltage Vr Max:32V; Reverse Voltage Vr1:1V; Reverse Voltage Vr2:28V; Termination Type:SMD
Manufacturer Aliases
NXP Semiconductors has several brands around the world that distributors may use as alternate names. NXP Semiconductors may also be known as the following names:
- NXP
- PHILIPS
- PHIL
- PHI
- PHILLIPS
- NXP USA Inc
- NXP SEMI
- NXP SEMICONDUCTOR
- PHILIPS/NXP
- PHILIPS SEMICONDUCTORS
- PHILIP
- Philips Semiconductor
- NXP/PHILIPS
- PHILPS
- PHILIPS COMPONENTS
- PHILIPS SEMI
- PHL
- PHLIPS
- NXP Semicon
- PHILIPS ECG
- NXP / Freescale
- PHILL
- Philips Semiconducto
- PHILLIP
- PHILI
- Philips Semiconductors
- NXP Semiconductors NV
- NXP
Inventory History
3 month trend: +0.00%
CAD Models
Download symbol, footprint, and 3D STEP
Alternate Parts
0 parts available
Technical Specifications
Physical
Contact PlatingTin
MountSurface Mount
Number of Pins2
Technical
Capacitance34.65 pF
Element ConfigurationSingle
Forward Current20 mA
Max Operating Temperature125 °C
Max Repetitive Reverse Voltage (Vrrm)35 V
Max Reverse Voltage (DC)32 V
Min Operating Temperature-55 °C
PackagingCut Tape
Reverse Voltage (DC)32 V
TerminationSMD/SMT
Dimensions
Height650 µm
Length1.25 mm
Width850 µm
Compliance
Environmental Classification
Lead FreeLead Free
Radiation HardeningNo
REACH SVHCNo SVHC
RoHSCompliant
Compliance Statements